XC2V1000-4FF896I
XC2V1000-4FF896I
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AMD Xilinx

XC2V1000-4FF896I


XC2V1000-4FF896I
F20-XC2V1000-4FF896I
Active
IC FPGA 432 I/O 896FCBGA
896-FCBGA (31x31)

XC2V1000-4FF896I ECAD Model


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XC2V1000-4FF896I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 1280
Total RAM Bits 737280
Number of I/O 432
Number of Gates 1000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 896-BBGA, FCBGA
Supplier Device Package 896-FCBGA (31x31)
Base Product Number XC2V1000

XC2V1000-4FF896I Datasheet Download


XC2V1000-4FF896I Overview



The XC2V1000-4FF896I is a high-performance field-programmable gate array (FPGA) chip manufactured by Xilinx. It is based on the Virtex-II Pro architecture, which combines a powerful embedded processor core with high-speed logic blocks and a wide range of I/O options.


The XC2V1000-4FF896I has a total of 896 logic cells, including 864 4-input look-up tables (LUTs) and 32 flip-flops. It also has 896 embedded RAM blocks, each capable of storing up to 16 bits of data. The chip also has a number of input/output blocks, including 4 dedicated clock inputs, 32 dedicated I/O pins, and 32 dedicated differential I/O pins.


The XC2V1000-4FF896I is designed for high-speed and high-performance applications, such as high-speed networking, video processing, and data communications. It is also suitable for use in embedded systems, as it has an embedded processor core and a wide range of I/O options.


In terms of power consumption, the XC2V1000-4FF896I has a maximum power dissipation of 7.5W at a supply voltage of 3.3V. It also has a minimum operating temperature of 0°C and a maximum operating temperature of 70°C.


Overall, the XC2V1000-4FF896I is a powerful and versatile FPGA chip, suitable for a wide range of high-performance applications.



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