
AMD Xilinx
XC2V1000-4FF896I
XC2V1000-4FF896I ECAD Model
XC2V1000-4FF896I Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-II | |
Package | Tray | |
Number of LABs/CLBs | 1280 | |
Total RAM Bits | 737280 | |
Number of I/O | 432 | |
Number of Gates | 1000000 | |
Voltage - Supply | 1.425V ~ 1.575V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 896-BBGA, FCBGA | |
Supplier Device Package | 896-FCBGA (31x31) | |
Base Product Number | XC2V1000 |
XC2V1000-4FF896I Datasheet Download
XC2V1000-4FF896I Overview
The XC2V1000-4FF896I is a high-performance field-programmable gate array (FPGA) chip manufactured by Xilinx. It is based on the Virtex-II Pro architecture, which combines a powerful embedded processor core with high-speed logic blocks and a wide range of I/O options.
The XC2V1000-4FF896I has a total of 896 logic cells, including 864 4-input look-up tables (LUTs) and 32 flip-flops. It also has 896 embedded RAM blocks, each capable of storing up to 16 bits of data. The chip also has a number of input/output blocks, including 4 dedicated clock inputs, 32 dedicated I/O pins, and 32 dedicated differential I/O pins.
The XC2V1000-4FF896I is designed for high-speed and high-performance applications, such as high-speed networking, video processing, and data communications. It is also suitable for use in embedded systems, as it has an embedded processor core and a wide range of I/O options.
In terms of power consumption, the XC2V1000-4FF896I has a maximum power dissipation of 7.5W at a supply voltage of 3.3V. It also has a minimum operating temperature of 0°C and a maximum operating temperature of 70°C.
Overall, the XC2V1000-4FF896I is a powerful and versatile FPGA chip, suitable for a wide range of high-performance applications.
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