XC2S150-6FGG256C

The XC2S150-6FGG256C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a low-cost, low-power, high-performance FPGA, designed for applications requiring a high degree of flexibility and reconfigurability.

The XC2S150-6FGG256C has a capacity of 150,000 system gates and 256 macrocells. It also offers two clock management tiles, which can be used to implement clock skew compensation, clock distribution and clock gating functions. The FPGA also has an on-chip, high-speed transceiver block that supports up to 6.25 Gbps data rates.

The XC2S150-6FGG256C is ideal for applications such as video and image processing, high-speed data acquisition, communications, and control systems. It is also suitable for applications in the automotive, industrial, medical, and consumer markets.

The XC2S150-6FGG256C is available in a 6mm x 6mm, 256-pin Fine-Pitch Ball Grid Array (FBGA) package. Its operating temperature range is from -40°C to +85°C. The FPGA also has a maximum power dissipation of 2.5W.

In summary, the XC2S150-6FGG256C is an ideal choice for applications requiring a low-cost, low-power, high-performance FPGA with a high degree of flexibility and reconfigurability. It is suitable for a wide range of applications, including video and image processing, high-speed data acquisition, communications, and control systems.