AMD Xilinx
XC2S15-5VQ100Q
XC2S15-5VQ100Q ECAD Model
XC2S15-5VQ100Q Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Number of Inputs | 64 | |
| Number of Outputs | 60 | |
| Number of Logic Cells | 432 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 1.5/3.3,2.5 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | QFP, TQFP100,.63SQ | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2S15-5VQ100Q Datasheet Download
XC2S15-5VQ100Q Overview
The chip model XC2S15-5VQ100Q is a state-of-the-art integrated circuit (IC) developed by Xilinx, a leading semiconductor manufacturer. It is a field-programmable gate array (FPGA) that has been designed to provide high performance, low power and a wide range of features. The XC2S15-5VQ100Q chip model offers a wide range of features, including a high-speed bus architecture, support for multiple clock domains, and advanced memory and logic functions.
The XC2S15-5VQ100Q chip model was designed with the intention of providing a high-performance, low-power solution for a variety of applications. It is capable of supporting a wide range of communication protocols, including Ethernet, USB, and Serial Peripheral Interface (SPI). Additionally, the chip model is designed to be highly configurable, allowing users to customize the FPGA to their specific application requirements.
In terms of industry trends, the XC2S15-5VQ100Q chip model is expected to be in high demand in the future. This is due to its ability to support a wide range of communication protocols, as well as its low power consumption and high performance. Additionally, the chip model is capable of supporting advanced communication systems, making it a viable option for applications that require the latest technology.
The original design intention of the XC2S15-5VQ100Q chip model was to provide a high-performance, low-power solution for a variety of applications. As such, the chip model is expected to remain relevant in the future, as the demand for advanced communication systems continues to grow. Additionally, the chip model is capable of being upgraded to support the latest technologies, allowing it to remain a viable option for applications that require the latest technology.
Overall, the XC2S15-5VQ100Q chip model is an ideal solution for a variety of applications that require high performance, low power, and support for advanced communication systems. The chip model is expected to remain in high demand in the future, as the demand for advanced communication systems continues to grow. Additionally, the chip model is capable of being upgraded to support the latest technologies, allowing it to remain a viable option for applications that require the latest technology.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||