AMD Xilinx
XC2S100E-7TQG144C
XC2S100E-7TQG144C ECAD Model
XC2S100E-7TQG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 202 | |
| Number of Outputs | 202 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 37000 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 37000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 100000 | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, PLASTIC, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2S100E-7TQG144C Datasheet Download
XC2S100E-7TQG144C Overview
The chip model XC2S100E-7TQG144C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx, Inc. It is a versatile chip that can be used for a wide range of applications, from consumer electronics to industrial automation. This chip is designed to be highly efficient and cost-effective, making it a popular choice for many industries.
The chip model XC2S100E-7TQG144C has many advantages. It has a high speed and low power consumption, making it suitable for a wide range of applications. It also has a small form factor, making it easier to integrate into existing systems. In addition, it has a large number of configurable logic blocks, allowing for high levels of customization. This makes it ideal for applications that require a high degree of flexibility and scalability.
The chip model XC2S100E-7TQG144C is expected to be in high demand in the future, as the need for more efficient and cost-effective solutions increases. As the demand for automation and machine learning increases, the need for chips with higher levels of customization will also increase. This chip is well-suited for this purpose, as it is highly configurable and can be used for a wide range of applications.
The original design intention of the chip model XC2S100E-7TQG144C is to provide a cost-effective solution for a wide range of applications. It is designed to be highly efficient and cost-effective, making it a popular choice for many industries. The chip is also designed to be highly flexible and scalable, allowing for a high degree of customization. This makes it ideal for applications that require a high degree of flexibility and scalability.
The chip model XC2S100E-7TQG144C is expected to be upgraded in the future, as new technologies become available. It is possible that the chip could be used in advanced communication systems, such as 5G networks. This would require the support of new technologies, such as higher-speed transceivers and more advanced logic blocks. It is also possible that the chip could be used in applications that require higher levels of customization, such as those related to machine learning and artificial intelligence.
In conclusion, the chip model XC2S100E-7TQG144C is a versatile and cost-effective solution for a wide range of applications. It is expected to be in high demand in the future, as the need for more efficient and cost-effective solutions increases. The chip is also designed to be highly configurable and scalable, allowing for a high degree of customization. It is possible that the chip could be upgraded in the future, as new technologies become available, and it could be used in advanced communication systems or applications related to machine learning and artificial intelligence.
You May Also Be Interested In
3,729 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||