XC2C512-6FTG256C
XC2C512-6FTG256C
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rohs

AMD Xilinx

XC2C512-6FTG256C


XC2C512-6FTG256C
F20-XC2C512-6FTG256C
Active
FLASH PLD, 6 ns, 512-Cell, CMOS, LBGA, BGA256,16X16,40
LBGA, BGA256,16X16,40

XC2C512-6FTG256C ECAD Model


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XC2C512-6FTG256C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Propagation Delay 6 ns
Number of Macro Cells 512
Number of I/O Lines 212
Programmable Logic Type FLASH PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 212 I/O
Additional Feature YES
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.5/3.3,1.8 V
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA, BGA256,16X16,40
Pin Count 256
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC2C512-6FTG256C Datasheet Download


XC2C512-6FTG256C Overview



The XC2C512-6FTG256C chip model is an advanced, high-performance digital signal processing solution designed for embedded processing, image processing, and other applications. It is based on the Xilinx Spartan-6 FPGA family, which is equipped with a range of features that make it suitable for a wide range of applications. The chip model is designed to be used with the HDL language, which is a high-level language that allows developers to quickly and easily create complex designs.


The original design intention of the XC2C512-6FTG256C chip model was to provide a high-performance solution for digital signal processing and embedded processing applications. The chip model is designed to be highly scalable, allowing for future upgrades and modifications. It is also capable of being used in advanced communication systems, thanks to its flexibility and scalability.


The product description of the XC2C512-6FTG256C chip model includes the following features: a Xilinx Spartan-6 FPGA family, a range of I/O pins, integrated memory, and a range of configurable logic blocks. The chip model also has a range of design features, such as clock management, power management, and debug capabilities. In addition, the chip model is also equipped with a range of on-chip peripherals, such as timers, counters, and analog-to-digital converters.


When designing with the XC2C512-6FTG256C chip model, there are a few key considerations that must be taken into account. First, the chip model is designed to be used with the HDL language, which requires a certain level of expertise. Second, the chip model is highly scalable, so the design must be able to accommodate future upgrades and modifications. Third, the chip model is designed for high-performance applications, so the design must be able to handle the data throughput and processing requirements.


In order to gain a better understanding of the XC2C512-6FTG256C chip model, it is recommended to look at case studies that have used the chip model in their designs. These case studies can provide valuable insights into the design process and can also provide useful tips and tricks for using the chip model. In addition, it is important to pay attention to any warnings or precautions that may be provided by the manufacturer when using the chip model.


In conclusion, the XC2C512-6FTG256C chip model is a powerful and highly scalable solution for digital signal processing and embedded processing applications. It is designed to be used with the HDL language and is capable of being used in advanced communication systems. When designing with the chip model, it is important to take into account the design considerations, as well as any warnings or precautions provided by the manufacturer. By taking these steps, designers can ensure that they are getting the most out of the chip model.



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