
AMD Xilinx
XC2C512-6FG324C
XC2C512-6FG324C ECAD Model
XC2C512-6FG324C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Propagation Delay | 6 ns | |
Number of Macro Cells | 512 | |
Number of I/O Lines | 270 | |
Programmable Logic Type | FLASH PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 270 I/O | |
Additional Feature | YES | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 1.5/3.3,1.8 V | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
JESD-30 Code | S-PBGA-B324 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 324 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 23 X 23 MM, 1.20 MM PITCH, FBGA-324 | |
Pin Count | 324 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2C512-6FG324C Datasheet Download
XC2C512-6FG324C Overview
The chip model XC2C512-6FG324C is a highly advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that allows for sophisticated designs to be created and implemented. The chip model XC2C512-6FG324C offers many advantages over other models, such as its fast processing speed, low power consumption, and high integration.
The chip model XC2C512-6FG324C is expected to be in high demand in the future due to its many advantages. It is perfect for applications that require a high degree of accuracy, reliability, and speed. It is also suitable for applications that require a high degree of customization and flexibility, such as those that require the use of multiple processors or other hardware components. Furthermore, its low power consumption makes it ideal for applications that require long-term operation, such as those found in the medical, automotive, and aerospace industries.
The original design intention of the chip model XC2C512-6FG324C was to provide a highly efficient and powerful processor with a high degree of customization and flexibility. It was designed to be used with the HDL language, which allows for sophisticated designs to be created and implemented. The chip model XC2C512-6FG324C is capable of handling a wide range of tasks, from basic arithmetic operations to complex image processing tasks. It is also capable of handling a wide range of communication protocols, making it suitable for advanced communication systems.
The chip model XC2C512-6FG324C has the potential for future upgrades, allowing for more complex tasks to be handled. It is also capable of being used with newer versions of the HDL language, allowing for more sophisticated designs to be created. Furthermore, it is capable of being used with newer communication protocols, making it suitable for advanced communication systems.
In conclusion, the chip model XC2C512-6FG324C is an advanced integrated circuit that is suitable for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which allows for sophisticated designs to be created and implemented. It has many advantages, such as its fast processing speed, low power consumption, and high integration. It is expected to be in high demand in the future due to its many advantages. It also has the potential for future upgrades, allowing for more complex tasks to be handled, and it is capable of being used with newer versions of the HDL language and newer communication protocols.
1,134 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $173.6608 | $173.6608 |
10+ | $171.7934 | $1,717.9344 |
100+ | $162.4568 | $16,245.6840 |
1000+ | $153.1202 | $76,560.1200 |
10000+ | $140.0490 | $140,049.0000 |
The price is for reference only, please refer to the actual quotation! |