XC2C512-6FG324C
XC2C512-6FG324C
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rohs

AMD Xilinx

XC2C512-6FG324C


XC2C512-6FG324C
F20-XC2C512-6FG324C
Active
FLASH PLD, 6 ns, 512-Cell, CMOS, 23 X 23 MM, 1.20 MM PITCH, FBGA-324
23 X 23 MM, 1.20 MM PITCH, FBGA-324

XC2C512-6FG324C ECAD Model


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XC2C512-6FG324C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Propagation Delay 6 ns
Number of Macro Cells 512
Number of I/O Lines 270
Programmable Logic Type FLASH PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 270 I/O
Additional Feature YES
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.5/3.3,1.8 V
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 324
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 23 X 23 MM, 1.20 MM PITCH, FBGA-324
Pin Count 324
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC2C512-6FG324C Datasheet Download


XC2C512-6FG324C Overview



The chip model XC2C512-6FG324C is a highly advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that allows for sophisticated designs to be created and implemented. The chip model XC2C512-6FG324C offers many advantages over other models, such as its fast processing speed, low power consumption, and high integration.


The chip model XC2C512-6FG324C is expected to be in high demand in the future due to its many advantages. It is perfect for applications that require a high degree of accuracy, reliability, and speed. It is also suitable for applications that require a high degree of customization and flexibility, such as those that require the use of multiple processors or other hardware components. Furthermore, its low power consumption makes it ideal for applications that require long-term operation, such as those found in the medical, automotive, and aerospace industries.


The original design intention of the chip model XC2C512-6FG324C was to provide a highly efficient and powerful processor with a high degree of customization and flexibility. It was designed to be used with the HDL language, which allows for sophisticated designs to be created and implemented. The chip model XC2C512-6FG324C is capable of handling a wide range of tasks, from basic arithmetic operations to complex image processing tasks. It is also capable of handling a wide range of communication protocols, making it suitable for advanced communication systems.


The chip model XC2C512-6FG324C has the potential for future upgrades, allowing for more complex tasks to be handled. It is also capable of being used with newer versions of the HDL language, allowing for more sophisticated designs to be created. Furthermore, it is capable of being used with newer communication protocols, making it suitable for advanced communication systems.


In conclusion, the chip model XC2C512-6FG324C is an advanced integrated circuit that is suitable for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which allows for sophisticated designs to be created and implemented. It has many advantages, such as its fast processing speed, low power consumption, and high integration. It is expected to be in high demand in the future due to its many advantages. It also has the potential for future upgrades, allowing for more complex tasks to be handled, and it is capable of being used with newer versions of the HDL language and newer communication protocols.



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Unit Price: $186.732
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Pricing (USD)

QTY Unit Price Ext Price
1+ $173.6608 $173.6608
10+ $171.7934 $1,717.9344
100+ $162.4568 $16,245.6840
1000+ $153.1202 $76,560.1200
10000+ $140.0490 $140,049.0000
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