AMD Xilinx
XC2C384-6FTG256C
XC2C384-6FTG256C ECAD Model
XC2C384-6FTG256C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 6 ns | |
| Number of Macro Cells | 384 | |
| Number of I/O Lines | 212 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 212 I/O | |
| Additional Feature | YES | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2C384-6FTG256C Datasheet Download
XC2C384-6FTG256C Overview
The XC2C384-6FTG256C chip model is a high-performance digital signal processing, embedded processing, and image processing solution. It is designed to meet the needs of a wide range of applications, from industrial automation and medical imaging to automotive and aerospace systems. The XC2C384-6FTG256C chip model is designed to be used with the HDL (Hardware Description Language) language, providing a powerful and flexible platform for developers.
The XC2C384-6FTG256C chip model is a field-programmable gate array (FPGA) device with a 256-bit wide data bus, allowing for high-speed data transfer. It has a total of 384 logic cells, with a maximum operating frequency of up to 400 MHz. The device also features a variety of I/O options, including LVDS, LVCMOS, and differential I/O. The XC2C384-6FTG256C chip model also includes a variety of memory options, including SRAM, ROM, and flash memory.
The XC2C384-6FTG256C chip model is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is also suitable for the development and popularization of future intelligent robots. To use the XC2C384-6FTG256C chip model effectively, it is important to understand the product description and specific design requirements. It is also important to understand the actual case studies and the precautions to be taken when using the device.
In order to use the XC2C384-6FTG256C chip model effectively, technical talents with knowledge of HDL language and FPGA design are needed. It is also important to have a good understanding of the product description and design requirements of the device, as well as the actual case studies and precautions to be taken when using the device. With the right knowledge, the XC2C384-6FTG256C chip model can be used to develop and popularize future intelligent robots.
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