AMD Xilinx
XC2C128-4TQ144C
XC2C128-4TQ144C ECAD Model
XC2C128-4TQ144C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 4.5 ns | |
| Number of Macro Cells | 128 | |
| Number of I/O Lines | 100 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 100 I/O | |
| Additional Feature | YES | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | 20 X 20 MM, 0.50 MM PITCH, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2C128-4TQ144C Datasheet Download
XC2C128-4TQ144C Overview
The XC2C128-4TQ144C chip model is a powerful and versatile integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is manufactured by Xilinx and is based on their Virtex-II Pro FPGA technology. This chip model is programmed using the HDL (Hardware Description Language) and supports a wide range of features, including high-speed data transfer, rich I/O capabilities, and advanced memory management.
The XC2C128-4TQ144C chip model is well-suited for applications that require fast and reliable performance, such as those in the automotive, industrial, and medical industries. It is also suitable for applications that require high levels of security, such as banking and finance. In addition, it is ideal for applications that require low power consumption and high system integration, such as those in the consumer electronics and telecommunications industries.
The XC2C128-4TQ144C chip model is designed to be highly flexible and customizable. It can be tailored to meet the specific requirements of each application, including the number of logic elements, the type of memory, and the number of I/O pins. It also supports numerous communication protocols, such as Ethernet, USB, and CANbus. Additionally, this chip model is designed to be compatible with a wide range of development tools, including Xilinx ISE and Vivado.
The XC2C128-4TQ144C chip model is a reliable and cost-effective solution for a variety of applications. It is easy to use and program, making it ideal for both experienced and novice designers. Furthermore, it is designed to be future-proof, so it can be used in applications that require the support of new technologies.
When designing with the XC2C128-4TQ144C chip model, it is important to consider the product description and specific design requirements. It is also important to understand the industry trends of the chip model and the future development of related industries. Additionally, it is important to consider actual case studies and precautions when designing with the XC2C128-4TQ144C chip model. By taking all of these factors into consideration, designers can ensure that their designs are optimized for their specific application.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||