AMD Xilinx
XC1765EDD8M
XC1765EDD8M ECAD Model
XC1765EDD8M Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 65.536 kbit | |
| Memory Width | 1 | |
| Organization | 64KX1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 5 V | |
| Clock Frequency-Max (fCLK) | 5 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 64000 | |
| Number of Words | 65.536 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 1.5 mA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| JESD-30 Code | R-CDIP-T8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 5.08 mm | |
| Length | 10.16 mm | |
| Width | 7.62 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | DIP | |
| Package Description | CERAMIC, DIP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 |
XC1765EDD8M Datasheet Download
XC1765EDD8M Overview
The XC1765EDD8M chip model is a high-performance digital signal processor (DSP) designed to meet the needs of today's fast-paced world. It is capable of handling complex tasks such as embedded processing, image processing, and other high-performance digital signal processing tasks. The XC1765EDD8M chip model is designed with the use of HDL (hardware description language) to ensure that the chip model is able to provide the highest level of performance.
The original design intention of the XC1765EDD8M chip model was to provide a reliable and powerful processor for high-performance digital signal processing applications. The chip model is capable of handling complex tasks and can be easily upgraded for future use. It is also possible to use the XC1765EDD8M chip model in advanced communication systems, as it is equipped with the necessary hardware and software to support such applications.
The XC1765EDD8M chip model can also be applied to a variety of intelligent scenarios. It can be used in networks to provide efficient communication and data processing capabilities. It can also be used in fully intelligent systems, allowing for the development of autonomous machines and robots. Furthermore, the XC1765EDD8M chip model is capable of providing the necessary processing power for artificial intelligence (AI) applications. This makes it a great choice for those looking to build intelligent systems that can learn and adapt to their environment.
In conclusion, the XC1765EDD8M chip model is a powerful and reliable processor that can be used in a variety of applications. It is capable of providing the necessary processing power for high-performance digital signal processing, embedded processing, image processing, advanced communication systems, and intelligent scenarios. With its ability to be easily upgraded for future use, the XC1765EDD8M chip model is an excellent choice for those looking to build powerful and reliable systems.
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