
AMD Xilinx
XC1765DDD8B
XC1765DDD8B ECAD Model
XC1765DDD8B Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Memory Density | 65.536 kbit | |
Memory Width | 1 | |
Organization | 64KX1 | |
Supply Voltage-Nom (Vsup) | 5 V | |
Power Supplies | 5 V | |
Clock Frequency-Max (fCLK) | 5 MHz | |
Memory IC Type | CONFIGURATION MEMORY | |
I/O Type | COMMON | |
Number of Functions | 1 | |
Number of Words Code | 64000 | |
Number of Words | 65.536 k | |
Operating Mode | SYNCHRONOUS | |
Output Characteristics | 3-STATE | |
Parallel/Serial | SERIAL | |
Standby Current-Max | 1.5 mA | |
Supply Current-Max | 10 µA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
JESD-30 Code | R-GDIP-T8 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Screening Level | MIL-STD-883 Class B | |
Number of Terminals | 8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Surface Mount | NO | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Seated Height-Max | 5.08 mm | |
Length | 10.16 mm | |
Width | 7.62 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | DIP | |
Package Description | CERDIP-8 | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.51 |
XC1765DDD8B Datasheet Download
XC1765DDD8B Overview
The XC1765DDD8B chip model is a high-performance, low-power, reconfigurable logic device that utilizes the HDL language. It is designed for use in high-performance digital signal processing, embedded processing, image processing, and other applications. This chip model is capable of handling more complex tasks than traditional microcontrollers, and offers the flexibility to be upgraded with additional features in the future.
The XC1765DDD8B chip model is built on the latest Xilinx Virtex-5 FPGA platform. It provides up to 8.5 million logic cells and abundant I/O resources. It also supports a wide range of high-speed serial transceivers, including PCI Express, Serial RapidIO, and XAUI. The device is also equipped with a DDR2/DDR3 memory controller and various DSP blocks, making it an ideal choice for high-speed data processing applications.
The XC1765DDD8B chip model is designed to meet the needs of advanced communication systems. It is capable of providing up to 10 Gb/s of data throughput, making it suitable for applications requiring high-speed data transmission, such as video streaming and telecommunication systems. It is also equipped with a range of built-in security features, such as AES encryption, which make it suitable for use in secure communication systems.
The XC1765DDD8B chip model is easy to use and can be quickly adapted to different applications. It is designed with a range of tools and development environments, such as the Xilinx ISE Design Suite, which allow users to quickly design, simulate, and program the device. It is also designed with a range of design guidelines and best practices to ensure the best possible performance and reliability.
When using the XC1765DDD8B chip model, it is important to take into consideration the device's power consumption. The device is designed to be low-power, but it is still important to ensure that the design is power-optimized to prevent any unnecessary power consumption. Additionally, it is important to ensure that the design is robust and reliable, as the device is intended for use in mission-critical applications.
The XC1765DDD8B chip model is a powerful, low-power, reconfigurable logic device that is designed for use in high-performance digital signal processing, embedded processing, image processing, and advanced communication systems. It is easy to use and can be quickly adapted to different applications. However, it is important to ensure that the design is power-optimized and robust to ensure the best possible performance.
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