AMD Xilinx
XC17256DDD8M
XC17256DDD8M ECAD Model
XC17256DDD8M Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 262.144 kbit | |
| Memory Width | 1 | |
| Organization | 256KX1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 5 V | |
| Clock Frequency-Max (fCLK) | 12 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 256000 | |
| Number of Words | 262.144 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 50 µA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| JESD-30 Code | R-GDIP-T8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 5.08 mm | |
| Length | 10.16 mm | |
| Width | 7.62 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | DIP | |
| Package Description | CERAMIC, DIP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant |
XC17256DDD8M Datasheet Download
XC17256DDD8M Overview
The XC17256DDD8M chip model is an innovative and highly advanced product from the semiconductor industry. It is a multi-functional chip that is designed to meet the needs of a wide range of applications, from basic communication systems to more advanced ones. It is a highly integrated and cost-effective solution for a variety of applications.
The XC17256DDD8M chip model integrates a variety of advanced technologies, including high-speed microprocessor, high-speed memory, and high-speed logic functions. It is also capable of supporting advanced communication systems, such as Gigabit Ethernet, Wi-Fi, Bluetooth, and other protocols. This chip model is also designed to be compatible with a variety of operating systems, such as Android, iOS, Windows, and Linux.
The XC17256DDD8M chip model is designed to be upgradable, which allows it to remain current with the latest technologies. This chip model is also designed to be compatible with a variety of applications, including networks, intelligent systems, and other applications. With this chip model, users can develop applications that can be used in a variety of scenarios, such as home automation, industrial automation, and other applications.
The XC17256DDD8M chip model is also designed to be used in the era of fully intelligent systems. It is capable of supporting a variety of intelligent scenarios, such as natural language processing, machine learning, and other applications. This chip model is also designed to be compatible with a variety of operating systems, such as Android, iOS, Windows, and Linux.
The XC17256DDD8M chip model is a highly advanced product from the semiconductor industry. It is designed to meet the needs of a wide range of applications, from basic communication systems to more advanced ones. It is also designed to be upgradable, which allows it to remain current with the latest technologies. This chip model is also designed to be used in the era of fully intelligent systems, and it is capable of supporting a variety of intelligent scenarios. With this chip model, users can develop applications that can be used in a variety of scenarios, such as home automation, industrial automation, and other applications.
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3,947 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $178.5600 | $178.5600 |
| 10+ | $176.6400 | $1,766.4000 |
| 100+ | $167.0400 | $16,704.0000 |
| 1000+ | $157.4400 | $78,720.0000 |
| 10000+ | $144.0000 | $144,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||