AMD Xilinx
XAZU3EG-L1SFVC784I
XAZU3EG-L1SFVC784I ECAD Model
XAZU3EG-L1SFVC784I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | S-PBGA-B784 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.32 mm | |
| Width | 23 mm | |
| Length | 23 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-784 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XAZU3EG-L1SFVC784I Datasheet Download
XAZU3EG-L1SFVC784I Overview
The XAZU3EG-L1SFVC784I is a powerful chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a hardware description language used to design electronic systems. This chip model is suitable for various applications, including the development and popularization of future intelligent robots.
The XAZU3EG-L1SFVC784I is a powerful chip model that offers a range of features and benefits. It has a high-performance processor core, which can handle a wide range of digital signal processing tasks. It also has an embedded processor, which is capable of handling image processing tasks. The chip model also has a powerful FPGA, which can be used to implement a variety of custom logic designs.
The XAZU3EG-L1SFVC784I is also designed to be used with HDL language. This language is used to design electronic systems and has become increasingly popular in recent years. It is used to create complex designs and can be used to create a variety of custom logic designs. It is also used to create a variety of digital signal processing tasks, such as image processing and embedded processing.
The XAZU3EG-L1SFVC784I is suitable for the development and popularization of future intelligent robots. It has the necessary features and capabilities to enable the development of sophisticated robotic systems. It is also capable of handling a variety of tasks, such as image processing and embedded processing. To use the model effectively, technical talents such as engineers and programmers are needed who are proficient in HDL language.
Overall, the XAZU3EG-L1SFVC784I is a powerful chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language and is suitable for the development and popularization of future intelligent robots. To use the model effectively, technical talents such as engineers and programmers are needed who are proficient in HDL language.
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3,059 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $463.2888 | $463.2888 |
| 10+ | $458.3072 | $4,583.0720 |
| 100+ | $433.3992 | $43,339.9200 |
| 1000+ | $408.4912 | $204,245.6000 |
| 10000+ | $373.6200 | $373,620.0000 |
| The price is for reference only, please refer to the actual quotation! | ||