AMD Xilinx
XAZU3EG-1SFVC784Q
XAZU3EG-1SFVC784Q ECAD Model
XAZU3EG-1SFVC784Q Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| JESD-30 Code | S-PBGA-B784 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.32 mm | |
| Width | 23 mm | |
| Length | 23 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-784 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XAZU3EG-1SFVC784Q Datasheet Download
XAZU3EG-1SFVC784Q Overview
The chip model XAZU3EG-1SFVC784Q is a powerful and advanced semiconductor device that has been developed to meet the growing needs of the modern computing industry. It is a high-performance model that is designed to provide reliable and high-speed data processing capabilities for a variety of applications. This model is equipped with a wide range of features, including a high-speed embedded processor, a large memory capacity, and a variety of interfaces. It is also capable of supporting the latest technologies such as artificial intelligence (AI) and machine learning (ML).
The chip model XAZU3EG-1SFVC784Q is expected to be in high demand in the near future due to its advanced features and capabilities. This model is ideal for use in a variety of industries, including automotive, medical, industrial, and consumer electronics. It is also well suited for use in networks, as it is capable of providing high-speed data processing and communications. Furthermore, it can be used to support a wide range of intelligent scenarios, such as facial recognition and autonomous driving.
The chip model XAZU3EG-1SFVC784Q is expected to play an increasingly important role in the development of intelligent systems in the future. It is capable of providing the necessary processing power and memory capacity to support the latest technologies such as AI and ML. In addition, it can be used to support a wide range of intelligent scenarios, such as facial recognition and autonomous driving. As the demand for intelligent systems continues to grow, the chip model XAZU3EG-1SFVC784Q is expected to be in high demand in the near future.
In conclusion, the chip model XAZU3EG-1SFVC784Q is a powerful and advanced semiconductor device that is expected to be in high demand in the near future due to its advanced features and capabilities. It is capable of providing the necessary processing power and memory capacity to support the latest technologies such as AI and ML. Furthermore, it can be used to support a wide range of intelligent scenarios, such as facial recognition and autonomous driving. As the demand for intelligent systems continues to grow, the chip model XAZU3EG-1SFVC784Q is expected to become increasingly important in the development of intelligent systems in the future.
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1,793 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $463.2888 | $463.2888 |
| 10+ | $458.3072 | $4,583.0720 |
| 100+ | $433.3992 | $43,339.9200 |
| 1000+ | $408.4912 | $204,245.6000 |
| 10000+ | $373.6200 | $373,620.0000 |
| The price is for reference only, please refer to the actual quotation! | ||