XA7Z010-1CLG225Q
XA7Z010-1CLG225Q
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rohs

AMD Xilinx

XA7Z010-1CLG225Q


XA7Z010-1CLG225Q
F20-XA7Z010-1CLG225Q
Active
CMOS, LFBGA, BGA225,15X15,32
LFBGA, BGA225,15X15,32

XA7Z010-1CLG225Q ECAD Model


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XA7Z010-1CLG225Q Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Power Supplies 1,1.8 V
Temperature Grade AUTOMOTIVE
UV Erasable N
JESD-30 Code S-PBGA-B225
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Screening Level AEC-Q100
Number of Terminals 225
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA225,15X15,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Seated Height-Max 1.5 mm
Width 13 mm
Length 13 mm
Ihs Manufacturer XILINX INC
Package Description LFBGA, BGA225,15X15,32
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XA7Z010-1CLG225Q Datasheet Download


XA7Z010-1CLG225Q Overview



The XA7Z010-1CLG225Q chip model is a highly advanced programmable logic device (PLD) developed by Xilinx, Inc. This model is based on the company's Zynq-7000 All Programmable SoC (System on Chip) architecture and is specifically designed to meet the needs of high-performance embedded systems. It is a powerful, low-cost, and versatile solution for embedded applications, such as industrial automation, medical imaging, and automotive infotainment.


The XA7Z010-1CLG225Q chip model is equipped with a dual-core ARM Cortex-A9 processor, a rich set of peripherals, and a high-performance FPGA fabric. It provides a wide range of features, including high-speed connectivity, a wide range of I/O options, and a flexible memory architecture. It has a low-power consumption design, making it ideal for battery-powered applications.


The XA7Z010-1CLG225Q chip model offers several advantages, including high-speed performance, a wide range of features, and a low-power consumption design. It is also highly configurable, allowing users to customize the FPGA fabric and the peripherals to meet their specific application requirements. Additionally, the chip model is designed to be highly scalable, making it suitable for future upgrades and modifications.


The XA7Z010-1CLG225Q chip model is expected to be in high demand in the future as more and more embedded applications are developed. This model is already being used in a wide range of industries, including industrial automation, medical imaging, and automotive infotainment. Its high-speed performance, wide range of features, and low-power consumption make it an ideal solution for these applications.


The product description and specific design requirements of the XA7Z010-1CLG225Q chip model are outlined in the user manual provided by Xilinx, Inc. The manual provides detailed information about the features, specifications, and usage of the model. Additionally, the manual provides actual case studies of the model's usage in various industries, as well as important precautions to consider when using the model.


In conclusion, the XA7Z010-1CLG225Q chip model is a powerful, low-cost, and versatile solution for embedded applications. It offers a wide range of features, including high-speed performance, a wide range of I/O options, and a flexible memory architecture. It is highly configurable, scalable, and suitable for future upgrades. The chip model is expected to be in high demand in the future, and the user manual provides detailed information about its features, specifications, and usage.



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Unit Price: $260.3292
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QTY Unit Price Ext Price
1+ $242.1062 $242.1062
10+ $239.5029 $2,395.0286
100+ $226.4864 $22,648.6404
1000+ $213.4699 $106,734.9720
10000+ $195.2469 $195,246.9000
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