AMD Xilinx
XA6SLX45T-3CSG324I
XA6SLX45T-3CSG324I ECAD Model
XA6SLX45T-3CSG324I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 190 | |
| Number of Outputs | 190 | |
| Number of Logic Cells | 43661 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Package Shape | SQUARE | |
| Clock Frequency-Max | 62.5 MHz | |
| Power Supplies | 1.2,2.5/3.3 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XA6SLX45T-3CSG324I Datasheet Download
XA6SLX45T-3CSG324I Overview
The XA6SLX45T-3CSG324I chip model is a powerful and versatile product developed by Xilinx, Inc. It is a member of the Spartan 6 family and is based on the Xilinx Spartan 6 FPGA logic architecture. The chip model is designed to provide a reliable and efficient platform for a wide range of applications, such as automotive, consumer, industrial, medical, and aerospace applications.
The XA6SLX45T-3CSG324I chip model has a number of features that make it ideal for a variety of applications. It is designed with a 45nm low-power process technology, which provides a low-power, low-cost solution for a wide range of applications. The chip model also features high-speed transceivers, which allow for fast data transmission and reception. Additionally, the chip model has a wide range of I/O and memory options, which allow for the integration of various peripherals and memory devices.
The XA6SLX45T-3CSG324I chip model is designed to meet the needs of advanced communication systems. It has a wide range of features that make it suitable for high-speed communication applications, such as 10G Ethernet, USB 3.0, and HDMI. Additionally, the chip model has a wide range of memory options, which allow for the integration of various memory devices, such as SRAM, DRAM, and Flash. The chip model also features a wide range of I/O options, which allow for the integration of various peripherals, such as sensors, cameras, and displays.
The XA6SLX45T-3CSG324I chip model is designed with the latest technologies and is capable of providing reliable and efficient performance. It is designed with a 45nm low-power process technology, which provides a low-power, low-cost solution for a wide range of applications. Additionally, the chip model has a wide range of I/O and memory options, which allow for the integration of various peripherals and memory devices.
The XA6SLX45T-3CSG324I chip model is designed with a number of features that make it suitable for a variety of applications. It is designed with a 45nm low-power process technology, which provides a low-power, low-cost solution for a wide range of applications. Additionally, the chip model has a wide range of I/O and memory options, which allow for the integration of various peripherals and memory devices. The chip model is also designed with a wide range of features that make it suitable for advanced communication systems, such as 10G Ethernet, USB 3.0, and HDMI.
The XA6SLX45T-3CSG324I chip model is suitable for a variety of intelligent scenarios, such as industrial automation, smart home systems, autonomous vehicles, and more. It is also suitable for use in the era of fully intelligent systems, as it is designed with a wide range of features that make it suitable for a variety of applications. Additionally, the chip model is designed with a wide range of I/O and memory options, which allow for the integration of various peripherals and memory devices.
When considering the application of the XA6SLX45T-3CSG324I chip model, it is important to consider a number of factors, such as the specific design requirements, the power consumption, the cost, and the compatibility with other components. Additionally, it is important to consider the actual case studies and the precautions that need to be taken when using the chip model.
In conclusion, the XA6SLX45T-3CSG324I chip model is a powerful and versatile product developed by Xilinx, Inc. It is designed with a 45nm low-power process technology, which provides a low-power, low-cost solution for a wide range of applications. Additionally, the chip model has a wide range of I/O and memory options, which allow for the integration of various peripherals and memory devices. The chip model is also designed with a wide range of features that make it suitable for advanced communication systems, such as 10G Ethernet, USB 3.0, and HDMI. Furthermore, the chip model is suitable for a variety of intelligent scenarios, such as industrial automation, smart home systems, autonomous vehicles, and more. Therefore, the XA6SLX45T-3CSG324I chip model is a great choice for a wide range of applications and can be used in the era of fully intelligent systems.
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4,517 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $104.1600 | $104.1600 |
| 10+ | $103.0400 | $1,030.4000 |
| 100+ | $97.4400 | $9,744.0000 |
| 1000+ | $91.8400 | $45,920.0000 |
| 10000+ | $84.0000 | $84,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||