AMD Xilinx
XA3S700A-4FGG400I
XA3S700A-4FGG400I ECAD Model
XA3S700A-4FGG400I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 311 | |
| Number of Outputs | 248 | |
| Number of Logic Cells | 13248 | |
| Number of Equivalent Gates | 700000 | |
| Number of CLBs | 1472 | |
| Combinatorial Delay of a CLB-Max | 4.88 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1472 CLBS, 700000 GATES | |
| Clock Frequency-Max | 667 MHz | |
| Power Supplies | 1.2,1.2/3.3,3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B400 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 400 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA400,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 21 mm | |
| Length | 21 mm | |
| Seated Height-Max | 2.43 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA400,20X20,40 | |
| Pin Count | 400 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XA3S700A-4FGG400I Datasheet Download
XA3S700A-4FGG400I Overview
The chip model XA3S700A-4FGG400I is a high-performance digital signal processor (DSP) developed by Xilinx, Inc. It is suitable for embedded processing, image processing, and other high-performance digital signal processing applications. It requires the use of HDL (Hardware Description Language) to program the chip.
The XA3S700A-4FGG400I chip model has become increasingly popular in recent years, due to its high performance and wide range of applications. It is used in a variety of industries, such as automotive, consumer electronics, medical, and aerospace. The chip model is also used in the development of intelligent robots, as it provides the necessary processing power and flexibility to power these robots.
The XA3S700A-4FGG400I chip model is expected to continue to be in high demand, as more industries and applications begin to take advantage of its capabilities. As the demand for high performance embedded processing continues to rise, the XA3S700A-4FGG400I chip model is expected to remain a popular choice. As technology advances, new technologies may be required to support the application environment.
To use the XA3S700A-4FGG400I chip model effectively, technical talents such as software engineers, hardware engineers, and HDL designers are needed. Software engineers are responsible for developing the software applications that run on the chip model. Hardware engineers are responsible for designing the hardware components that make up the chip model. Lastly, HDL designers are responsible for writing the HDL code that programs the chip model.
The XA3S700A-4FGG400I chip model is a powerful and versatile digital signal processor that can be used in a variety of industries and applications. It can be used to develop and popularize future intelligent robots, as well as other embedded processing applications. To effectively use the chip model, technical talents such as software engineers, hardware engineers, and HDL designers are needed. As technology advances, new technologies may be required to support the application environment.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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