XA3S250E-4CPG132I
XA3S250E-4CPG132I
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rohs

AMD Xilinx

XA3S250E-4CPG132I


XA3S250E-4CPG132I
F20-XA3S250E-4CPG132I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, CSP-132
LEAD FREE, CSP-132

XA3S250E-4CPG132I ECAD Model


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XA3S250E-4CPG132I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 92
Number of Outputs 85
Number of Logic Cells 5508
Number of Equivalent Gates 250000
Number of CLBs 612
Combinatorial Delay of a CLB-Max 4.88 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level AEC-Q100
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 612 CLBS, 250000 GATES
Clock Frequency-Max 572 MHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B132
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 132
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA132,14X14,20
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 500 µm
Terminal Position BOTTOM
Width 8 mm
Length 8 mm
Seated Height-Max 1.1 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, CSP-132
Pin Count 132
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XA3S250E-4CPG132I Datasheet Download


XA3S250E-4CPG132I Overview



The chip model XA3S250E-4CPG132I is a highly advanced and sophisticated chip model. It is designed to meet the needs of a wide range of applications, from the most basic to the most advanced. It is a powerful and versatile chip model that can be used in a variety of different applications.


The chip model XA3S250E-4CPG132I is designed to support a wide range of communication systems, including wireless, cellular, satellite and other types of communication systems. It is also designed to support future technologies, such as 5G, artificial intelligence, and the Internet of Things. The chip model can also be used in the development and popularization of future intelligent robots.


The chip model XA3S250E-4CPG132I is designed to be highly versatile and scalable, allowing for future upgrades and enhancements. It is designed to be easily integrated into existing systems, and can be adapted to meet the needs of different applications. In addition, the chip model is designed to be easy to use and requires minimal technical knowledge to be used effectively.


In terms of industry trends, the chip model XA3S250E-4CPG132I is expected to be widely used in a variety of different applications. It is expected to be used in the development and popularization of future intelligent robots, as well as in the development of advanced communication systems. It is also expected to be used in the development of new technologies, such as 5G and artificial intelligence.


Overall, the chip model XA3S250E-4CPG132I is a highly advanced and sophisticated chip model. It is designed to meet the needs of a wide range of applications, from the most basic to the most advanced. It is also designed to be highly versatile and scalable, allowing for future upgrades and enhancements. It is expected to be widely used in a variety of different applications, including the development and popularization of future intelligent robots and the development of advanced communication systems.



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Unit Price: $53.8855
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Pricing (USD)

QTY Unit Price Ext Price
1+ $50.1135 $50.1135
10+ $49.5747 $495.7466
100+ $46.8804 $4,688.0385
1000+ $44.1861 $22,093.0550
10000+ $40.4141 $40,414.1250
The price is for reference only, please refer to the actual quotation!

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