
AMD Xilinx
XA3S250E-4CPG132I
XA3S250E-4CPG132I ECAD Model
XA3S250E-4CPG132I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 92 | |
Number of Outputs | 85 | |
Number of Logic Cells | 5508 | |
Number of Equivalent Gates | 250000 | |
Number of CLBs | 612 | |
Combinatorial Delay of a CLB-Max | 4.88 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | AEC-Q100 | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 612 CLBS, 250000 GATES | |
Clock Frequency-Max | 572 MHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B132 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 132 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA132,14X14,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 500 µm | |
Terminal Position | BOTTOM | |
Width | 8 mm | |
Length | 8 mm | |
Seated Height-Max | 1.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, CSP-132 | |
Pin Count | 132 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XA3S250E-4CPG132I Datasheet Download
XA3S250E-4CPG132I Overview
The chip model XA3S250E-4CPG132I is a highly advanced and sophisticated chip model. It is designed to meet the needs of a wide range of applications, from the most basic to the most advanced. It is a powerful and versatile chip model that can be used in a variety of different applications.
The chip model XA3S250E-4CPG132I is designed to support a wide range of communication systems, including wireless, cellular, satellite and other types of communication systems. It is also designed to support future technologies, such as 5G, artificial intelligence, and the Internet of Things. The chip model can also be used in the development and popularization of future intelligent robots.
The chip model XA3S250E-4CPG132I is designed to be highly versatile and scalable, allowing for future upgrades and enhancements. It is designed to be easily integrated into existing systems, and can be adapted to meet the needs of different applications. In addition, the chip model is designed to be easy to use and requires minimal technical knowledge to be used effectively.
In terms of industry trends, the chip model XA3S250E-4CPG132I is expected to be widely used in a variety of different applications. It is expected to be used in the development and popularization of future intelligent robots, as well as in the development of advanced communication systems. It is also expected to be used in the development of new technologies, such as 5G and artificial intelligence.
Overall, the chip model XA3S250E-4CPG132I is a highly advanced and sophisticated chip model. It is designed to meet the needs of a wide range of applications, from the most basic to the most advanced. It is also designed to be highly versatile and scalable, allowing for future upgrades and enhancements. It is expected to be widely used in a variety of different applications, including the development and popularization of future intelligent robots and the development of advanced communication systems.
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5,319 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $50.1135 | $50.1135 |
10+ | $49.5747 | $495.7466 |
100+ | $46.8804 | $4,688.0385 |
1000+ | $44.1861 | $22,093.0550 |
10000+ | $40.4141 | $40,414.1250 |
The price is for reference only, please refer to the actual quotation! |