MPF200T-1FCSG536E

The MPF200T-1FCSG536E is a low power, high performance, field programmable gate array (FPGA) chip model manufactured by Microsemi Corporation. It is designed for use in a variety of embedded applications, such as industrial automation, medical imaging, and military and aerospace systems. The chip features a 536-pin Fine-pitch Ball Grid Array (FBGA) package with a maximum power dissipation of 3.5W.

The MPF200T-1FCSG536E is based on a 0.18um CMOS process and uses a low-power, high-density architecture. It has a total of 8,192 logic cells, 256Kbits of embedded RAM, and 16Kbits of distributed embedded RAM. It also includes an on-chip clock generator, an on-chip phase-locked loop (PLL), and an on-chip power-on reset circuit.

The MPF200T-1FCSG536E is designed to provide high performance and low power consumption. It has a maximum clock frequency of 200MHz and a maximum I/O speed of 250MHz. It also features a wide operating temperature range of -40°C to +85°C and is compatible with a variety of logic families, including LVTTL, LVCMOS, SSTL, HSTL, and GTL.

The MPF200T-1FCSG536E is designed for use in a variety of embedded applications, including industrial automation, medical imaging, and military and aerospace systems. It is also suitable for use in applications requiring high reliability and low power.