Microchip Technology Inc
APA750-BGG456I
APA750-BGG456I ECAD Model
APA750-BGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 356 | |
| Number of Outputs | 356 | |
| Number of Logic Cells | 32768 | |
| Number of Equivalent Gates | 750000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 750000 GATES | |
| Clock Frequency-Max | 180 MHz | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.54 mm | |
| Ihs Manufacturer | ACTEL CORP | |
| Package Description | 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-456 | |
| Reach Compliance Code | compliant |
APA750-BGG456I Datasheet Download
APA750-BGG456I Overview
The APA750-BGG456I is an integrated circuit chip designed for use in a wide range of electronic applications. This model is manufactured by the Advanced Processors and Applications (APA) Corporation and is available in a variety of packages, including a 48-pin TSSOP, a 64-pin QFN, and a 64-pin PQFP.
The APA750-BGG456I is a low-power, high-performance chip that is capable of operating at a maximum frequency of up to 200 MHz. It features a 32-bit RISC processor core, with an on-chip memory controller, a DMA controller, and a peripheral bus interface. The chip also has an integrated 32-bit floating-point unit for enhanced performance.
The APA750-BGG456I is designed to be used in a wide range of applications, including embedded systems, automotive systems, industrial automation, medical and healthcare devices, and consumer electronics. It is suitable for applications that require low power consumption, high performance, and a wide range of peripherals. The chip is also capable of supporting a variety of operating systems, including Linux, Windows, and Android.
The APA750-BGG456I is a versatile and reliable chip that is suitable for a wide range of applications. It offers a low-power solution for embedded systems and is capable of supporting a variety of operating systems. It is designed to be used in a wide range of applications, from automotive systems to consumer electronics.
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1,610 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,380.7375 | $1,380.7375 |
| 10+ | $1,365.8909 | $13,658.9088 |
| 100+ | $1,291.6577 | $129,165.7680 |
| 1000+ | $1,217.4245 | $608,712.2400 |
| 10000+ | $1,113.4980 | $1,113,498.0000 |
| The price is for reference only, please refer to the actual quotation! | ||