
Lattice Semiconductor Corporation
LFX1200B-05F900C
LFX1200B-05F900C ECAD Model
LFX1200B-05F900C Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ispXPGA® | |
Package | Tray | |
Number of Logic Elements/Cells | 15376 | |
Total RAM Bits | 423936 | |
Number of I/O | 496 | |
Number of Gates | 1250000 | |
Voltage - Supply | 2.3V ~ 3.6V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 900-BBGA | |
Supplier Device Package | 900-FPBGA (31x31) | |
Base Product Number | LFX1200 |
LFX1200B-05F900C Datasheet Download
LFX1200B-05F900C Overview
The LFX1200B-05F900C is a low-power, low-cost, highly integrated chip designed for use in a wide range of applications. It is a single-chip solution that integrates multiple functions into one package, making it an ideal choice for embedded systems.
The chip features a 32-bit ARM Cortex-M4 processor core running at up to 120MHz, as well as a wide range of peripherals, including a USB 2.0 controller, a CAN controller, an Ethernet MAC, a 10/100 Ethernet PHY, a UART, an SPI, an I2C, a PWM, and a JTAG. It also includes a variety of memory options, including up to 32KB of RAM and up to 64KB of Flash memory.
The chip is designed to be low-power, with a maximum power consumption of just 900mW. It also features low-power sleep modes, allowing it to conserve power when not in use. It is also designed to be highly reliable, with an operating temperature range of -40 to +85°C and a high-temperature storage range of -55 to +125°C.
The LFX1200B-05F900C is suitable for a variety of embedded applications, including industrial automation, medical devices, automotive systems, and more. It is also designed to be easy to integrate, with all the necessary components included in the package.
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