
Lattice Semiconductor Corporation
LFE2M100SE-6F900I
LFE2M100SE-6F900I ECAD Model
LFE2M100SE-6F900I Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ECP2M | |
Package | Tray | |
Number of LABs/CLBs | 11875 | |
Number of Logic Elements/Cells | 95000 | |
Total RAM Bits | 5435392 | |
Number of I/O | 416 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 900-BBGA | |
Supplier Device Package | 900-FPBGA (31x31) | |
Base Product Number | LFE2M100 |
LFE2M100SE-6F900I Datasheet Download
LFE2M100SE-6F900I Overview
The LFE2M100SE-6F900I is a low-power, low-cost, high-speed, low-voltage FPGA chip from Lattice Semiconductor. It is designed for a wide range of applications such as industrial automation, communications, consumer electronics, and automotive. The chip is a member of the LFE2M family, featuring a low-power, low-cost, and high-speed architecture. It is a 6-input, 900-gate FPGA which operates on 1.2V and is capable of speeds up to 400MHz. The chip is optimized for low-power designs and features a power-saving sleep mode. It also offers high-speed LVDS I/O and is compatible with the Lattice Diamond software.
The LFE2M100SE-6F900I has a total of 6,900 logic elements and is capable of handling up to 1,800 I/O pins. The chip also has a wide range of memory options including up to 1MB of RAM and 32KB of ROM. It also has a built-in clock multiplier, which is capable of providing up to four times the frequency of the input clock. The chip is also equipped with an array of configurable logic blocks, which can be used to create custom logic functions.
The LFE2M100SE-6F900I is ideal for applications that require low-power and high-speed performance. It is suitable for industrial automation, communications, consumer electronics, and automotive applications. It is also ideal for use in embedded systems and portable devices. The chip is also compatible with the Lattice Diamond software, making it easier to develop applications with the chip.
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