LFSCM3GA80EP1-7FC1152C
LFSCM3GA80EP1-7FC1152C
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Lattice Semiconductor Corporation

LFSCM3GA80EP1-7FC1152C


LFSCM3GA80EP1-7FC1152C
SCM
F11-LFSCM3GA80EP1-7FC1152C
Active
IC FPGA 660 I/O 1152FCBGA
1152-CFCBGA (35x35)

LFSCM3GA80EP1-7FC1152C ECAD Model


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LFSCM3GA80EP1-7FC1152C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 20000
Number of Logic Elements/Cells 80000
Total RAM Bits 5816320
Number of I/O 660
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BCBGA, FCBGA
Supplier Device Package 1152-CFCBGA (35x35)
Base Product Number LFSCM3GA80

LFSCM3GA80EP1-7FC1152C Datasheet Download


LFSCM3GA80EP1-7FC1152C Overview



The LFSCM3GA80EP1-7FC1152C chip model is a low-power, high-performance 8-bit microcontroller from NXP Semiconductors. It is based on the Arm Cortex-M3 processor core and is designed for embedded applications requiring low power consumption, high performance, and a small form factor. It features a 32-bit RISC CPU with a maximum clock frequency of up to 72 MHz, up to 4KB of instruction cache, and up to 16KB of data cache. It also has a rich set of peripherals, including a 10-bit ADC, an I2C interface, a UART, an SPI interface, an I2S interface, and a CAN interface.


The LFSCM3GA80EP1-7FC1152C is ideal for embedded systems requiring high performance and low power consumption. It is suitable for use in a wide range of applications, including industrial control, automotive, medical, and consumer electronics. It is also well-suited for use in wireless applications such as Bluetooth, Zigbee, and Wi-Fi. Additionally, it is highly reliable and features a wide operating temperature range of -40°C to +85°C.


Overall, the LFSCM3GA80EP1-7FC1152C is an excellent choice for embedded applications requiring low power consumption, high performance, and a small form factor. It is reliable, feature-rich, and suitable for a wide range of applications.



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