LFSCM3GA80EP1-6FF1152I
LFSCM3GA80EP1-6FF1152I
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Lattice Semiconductor Corporation

LFSCM3GA80EP1-6FF1152I


LFSCM3GA80EP1-6FF1152I
SCM
F11-LFSCM3GA80EP1-6FF1152I
Active
IC FPGA 660 I/O 1152FCBGA
1152-FCBGA (35x35)

LFSCM3GA80EP1-6FF1152I ECAD Model


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LFSCM3GA80EP1-6FF1152I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 20000
Number of Logic Elements/Cells 80000
Total RAM Bits 5816320
Number of I/O 660
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Base Product Number LFSCM3GA80

LFSCM3GA80EP1-6FF1152I Datasheet Download


LFSCM3GA80EP1-6FF1152I Overview



The LFSCM3GA80EP1-6FF1152I is a low-power, low-voltage, mixed-signal system-on-chip (SoC) from NXP Semiconductors. It is designed for use in embedded applications such as automotive, industrial, and consumer electronics.


The LFSCM3GA80EP1-6FF1152I is based on a 32-bit ARM Cortex-M3 processor core, running at up to 80 MHz. It features 256KB of flash memory, 32KB of SRAM, and an integrated 10/100 Ethernet MAC. It also includes a wide range of peripherals, such as I2C, SPI, UART, and CAN interfaces.


The device is designed to operate at a supply voltage of 1.6 V to 3.6 V, and is rated for operation at temperatures from -40°C to 125°C. It also features a range of power saving modes, including a low-power sleep mode, allowing for extended battery life in battery-powered applications.


The LFSCM3GA80EP1-6FF1152I is suitable for a wide range of embedded applications, including automotive, industrial, and consumer electronics. It is designed to meet the needs of high-performance applications, while also providing low-power operation and a wide temperature range.



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