LFSCM3GA80EP1-5FCN1152I
LFSCM3GA80EP1-5FCN1152I
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Lattice Semiconductor Corporation

LFSCM3GA80EP1-5FCN1152I


LFSCM3GA80EP1-5FCN1152I
SCM
F11-LFSCM3GA80EP1-5FCN1152I
Active
IC FPGA 660 I/O 1152FCBGA
1152-FCBGA (35x35)

LFSCM3GA80EP1-5FCN1152I ECAD Model


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LFSCM3GA80EP1-5FCN1152I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 20000
Number of Logic Elements/Cells 80000
Total RAM Bits 5816320
Number of I/O 660
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Base Product Number LFSCM3GA80

LFSCM3GA80EP1-5FCN1152I Datasheet Download


LFSCM3GA80EP1-5FCN1152I Overview



The LFSCM3GA80EP1-5FCN1152I is a high-performance, low-power, low-footprint System-on-Chip (SoC) model manufactured by Fujitsu. It is designed to provide a wide range of applications in the automotive, industrial, and consumer markets.


The SoC is based on a 32-bit ARM Cortex-M3 processor core, with a clock frequency of up to 80MHz. It features a rich set of peripherals, such as a 12-bit ADC, a 10-bit DAC, a CAN controller, an Ethernet MAC, a USB 2.0 host/device controller, and an I2C interface. It also features a wide range of memory options, including 8KB of RAM, 256KB of flash memory, and 8KB of EEPROM memory.


The SoC is designed to be used in a wide range of applications, including automotive, industrial, and consumer applications. It is suitable for use in motor control, power management, and automotive body control applications. It is also suitable for use in industrial control systems, safety systems, and consumer electronics.


The SoC is designed to be highly energy-efficient and low-power, with a low-power consumption of only 2.5mA/MHz. It also features a low-footprint package, with a size of only 11.52mm x 8mm.


Overall, the LFSCM3GA80EP1-5FCN1152I is a high-performance, low-power, low-footprint SoC model designed for use in a wide range of automotive, industrial, and consumer applications. It features a rich set of peripherals, a wide range of memory options, and a low-power consumption and low-footprint package.



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