LFSCM3GA40EP1-6FFA1020I
LFSCM3GA40EP1-6FFA1020I
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Lattice Semiconductor Corporation

LFSCM3GA40EP1-6FFA1020I


LFSCM3GA40EP1-6FFA1020I
SCM
F11-LFSCM3GA40EP1-6FFA1020I
Active
IC FPGA 562 I/O 1020BGA
1020-OFcBGA Rev 2 (33x33)

LFSCM3GA40EP1-6FFA1020I ECAD Model


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LFSCM3GA40EP1-6FFA1020I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 10000
Number of Logic Elements/Cells 40000
Total RAM Bits 4075520
Number of I/O 562
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 1020-BBGA, FCBGA
Supplier Device Package 1020-OFcBGA Rev 2 (33x33)
Base Product Number LFSCM3GA40

LFSCM3GA40EP1-6FFA1020I Datasheet Download


LFSCM3GA40EP1-6FFA1020I Overview



The LFSCM3GA40EP1-6FFA1020I is a low-power, low-footprint, high-performance embedded system-on-chip (SoC) designed for a wide range of embedded applications. It is based on the ARM Cortex-M3 processor core, and features a wide range of peripherals, including Ethernet, USB, CAN, I2C, SPI, and UART interfaces. The chip also includes a range of embedded memories, including SRAM, flash, and ROM.


The LFSCM3GA40EP1-6FFA1020I is designed for low-power operation, with a power consumption of only 0.6W at full speed. It is also designed for high-performance operation, with a clock speed of up to 120MHz and a maximum throughput of up to 100 MIPS. Additionally, the chip features a range of advanced features, including an on-chip debug unit, a power management unit, and a range of security features.


The LFSCM3GA40EP1-6FFA1020I is designed for a wide range of embedded applications, including industrial automation, medical devices, consumer electronics, and automotive applications. It is also suitable for use in a variety of operating systems, such as Linux, Android, and Windows. The chip is available in a range of package sizes, including a 6mmx6mm BGA package.


Overall, the LFSCM3GA40EP1-6FFA1020I is an ideal solution for embedded applications that require low power consumption, high performance, and a wide range of features. It is suitable for a variety of applications, and is available in a range of package sizes.



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