LFSCM3GA40EP1-6FCN1152I
LFSCM3GA40EP1-6FCN1152I
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rohs

Lattice Semiconductor Corporation

LFSCM3GA40EP1-6FCN1152I


LFSCM3GA40EP1-6FCN1152I
SCM
F11-LFSCM3GA40EP1-6FCN1152I
Active
IC FPGA 604 I/O 1152FCBGA
1152-FCBGA (35x35)

LFSCM3GA40EP1-6FCN1152I ECAD Model


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LFSCM3GA40EP1-6FCN1152I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 10000
Number of Logic Elements/Cells 40000
Total RAM Bits 4075520
Number of I/O 604
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Base Product Number LFSCM3GA40

LFSCM3GA40EP1-6FCN1152I Datasheet Download


LFSCM3GA40EP1-6FCN1152I Overview



The LFSCM3GA40EP1-6FCN1152I chip model is a low-power, low-cost, low-footprint System-on-Chip (SoC) from NXP Semiconductors. It is designed to be used in portable, battery-powered applications such as wearables, medical devices, and IoT devices.


The LFSCM3GA40EP1-6FCN1152I SoC is based on the ARM Cortex-M3 core architecture and is clocked at up to 40 MHz. It features a rich set of integrated peripherals, including a 10-bit ADC, four UARTs, SPI, I2C, and a 12-bit DAC. It also includes an integrated power management unit, which allows it to operate at low power levels.


The SoC integrates a wide range of memory and storage components, including up to 1 MB of flash memory, up to 192 KB of SRAM, and up to 8 KB of EEPROM. It also supports up to two external memory devices, such as SDRAM or NOR flash.


The LFSCM3GA40EP1-6FCN1152I SoC is designed to be used in a variety of applications, including wearables, medical devices, IoT devices, industrial control systems, and consumer electronics. It is also suitable for use in automotive and aerospace applications due to its low power consumption and small form factor. In addition, it is RoHS compliant and has a wide operating temperature range (-40°C to 85°C).



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