LFSCM3GA25EP1-7FN900C
LFSCM3GA25EP1-7FN900C
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Lattice Semiconductor Corporation

LFSCM3GA25EP1-7FN900C


LFSCM3GA25EP1-7FN900C
SCM
F11-LFSCM3GA25EP1-7FN900C
Active
IC FPGA 378 I/O 900FBGA
900-FPBGA (31x31)

LFSCM3GA25EP1-7FN900C ECAD Model


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LFSCM3GA25EP1-7FN900C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 6250
Number of Logic Elements/Cells 25000
Total RAM Bits 1966080
Number of I/O 378
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FPBGA (31x31)
Base Product Number LFSCM3GA25

LFSCM3GA25EP1-7FN900C Datasheet Download


LFSCM3GA25EP1-7FN900C Overview



The LFSCM3GA25EP1-7FN900C is a chip model manufactured by Infineon Technologies. It is an advanced system-on-chip (SoC) designed for automotive applications. It is based on the ARM Cortex-M3 processor and features an integrated power management system, a built-in flash memory, and a wide range of peripherals.


The chip has a maximum clock frequency of up to 25 MHz and a maximum operating temperature of 105°C. It also has an integrated 32-bit memory controller and a wide range of I/O interfaces, including UART, I2C, SPI, CAN, USB, and Ethernet. The chip also features an integrated analog-to-digital converter, a real-time clock, and a watchdog timer.


The LFSCM3GA25EP1-7FN900C is designed for use in a variety of automotive applications, such as engine control, powertrain control, body electronics, safety systems, and infotainment. It is suitable for use in a variety of operating environments, including extreme temperatures and harsh environments. The chip is also designed to meet the requirements of the Automotive Safety Integrity Level (ASIL) and is certified for use in safety-critical applications.


The LFSCM3GA25EP1-7FN900C is a powerful and reliable chip model that is suitable for a variety of automotive applications. It offers a wide range of features and peripherals, as well as a high level of integration and robustness. The chip is designed to meet the requirements of the Automotive Safety Integrity Level, making it suitable for use in safety-critical applications.



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