LFSCM3GA25EP1-6FFAN1020I
LFSCM3GA25EP1-6FFAN1020I
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Lattice Semiconductor Corporation

LFSCM3GA25EP1-6FFAN1020I


LFSCM3GA25EP1-6FFAN1020I
SCM
F11-LFSCM3GA25EP1-6FFAN1020I
Active
IC FPGA 476 I/O 1020BGA
1020-OFcBGA Rev 2 (33x33)

LFSCM3GA25EP1-6FFAN1020I ECAD Model


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LFSCM3GA25EP1-6FFAN1020I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 6250
Number of Logic Elements/Cells 25000
Total RAM Bits 1966080
Number of I/O 476
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 1020-BBGA, FCBGA
Supplier Device Package 1020-OFcBGA Rev 2 (33x33)
Base Product Number LFSCM3GA25

LFSCM3GA25EP1-6FFAN1020I Datasheet Download


LFSCM3GA25EP1-6FFAN1020I Overview



The LFSCM3GA25EP1-6FFAN1020I is a high-performance, low-power, low-cost chip model designed by Fujitsu Semiconductor. It is built on a 65nm process, and is a general-purpose processor that supports a wide range of applications.


The chip features a 32-bit ARMv7-A architecture with a Cortex-A8 processor core and a NEON SIMD engine. It has a clock speed of up to 1.2GHz, and includes an integrated L1 cache of 32KB. It also includes a 2MB L2 cache. It supports up to 8GB of DDR3 RAM, as well as a range of external memory interfaces.


The chip supports a range of multimedia formats, including H.264, H.265, VP8, and VP9. It also supports a range of connectivity interfaces, including Wi-Fi, Bluetooth, and USB.


The LFSCM3GA25EP1-6FFAN1020I is suitable for a wide range of applications, including embedded systems, automotive systems, industrial automation, and consumer electronics. It is particularly suited to applications that require high performance and low power consumption, such as digital signage, medical imaging, and robotics.



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