
Lattice Semiconductor Corporation
LFSCM3GA25EP1-5F900I
LFSCM3GA25EP1-5F900I ECAD Model
LFSCM3GA25EP1-5F900I Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | SCM | |
Package | Tray | |
Number of LABs/CLBs | 6250 | |
Number of Logic Elements/Cells | 25000 | |
Total RAM Bits | 1966080 | |
Number of I/O | 378 | |
Voltage - Supply | 0.95V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 105°C (TJ) | |
Package / Case | 900-BBGA | |
Supplier Device Package | 900-FPBGA (31x31) | |
Base Product Number | LFSCM3GA25 |
LFSCM3GA25EP1-5F900I Datasheet Download
LFSCM3GA25EP1-5F900I Overview
The LFSCM3GA25EP1-5F900I is a low-power, high-performance, low-cost System-on-Chip (SoC) designed for a variety of embedded applications. This chip is based on a 32-bit ARM Cortex-M3 processor core, and it is fabricated using a 90 nm CMOS process technology. It has an on-chip SRAM of up to 32 kB and a Flash memory of up to 256 kB. It also features a variety of peripherals including a 10/100 Ethernet MAC, two USB 2.0 ports, an LCD controller, an I2C interface, a UART, and a CAN bus. This SoC is also equipped with a range of power saving features such as dynamic voltage scaling, clock gating, and sleep modes.
The LFSCM3GA25EP1-5F900I is ideal for a wide range of embedded applications such as industrial automation, medical devices, consumer electronics, and automotive applications. It is also well-suited for applications that require low power consumption, high performance, and low cost. This chip is also RoHS compliant and is available in a range of packages, including LQFP, QFN, and BGA. It is also supported by a range of development tools, including an integrated development environment (IDE), a debugger, and an RTOS.
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