LFSCM3GA25EP1-5F900I
LFSCM3GA25EP1-5F900I
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rohs

Lattice Semiconductor Corporation

LFSCM3GA25EP1-5F900I


LFSCM3GA25EP1-5F900I
SCM
F11-LFSCM3GA25EP1-5F900I
Active
IC FPGA 378 I/O 900FBGA
900-FPBGA (31x31)

LFSCM3GA25EP1-5F900I ECAD Model


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LFSCM3GA25EP1-5F900I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 6250
Number of Logic Elements/Cells 25000
Total RAM Bits 1966080
Number of I/O 378
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FPBGA (31x31)
Base Product Number LFSCM3GA25

LFSCM3GA25EP1-5F900I Datasheet Download


LFSCM3GA25EP1-5F900I Overview



The LFSCM3GA25EP1-5F900I is a low-power, high-performance, low-cost System-on-Chip (SoC) designed for a variety of embedded applications. This chip is based on a 32-bit ARM Cortex-M3 processor core, and it is fabricated using a 90 nm CMOS process technology. It has an on-chip SRAM of up to 32 kB and a Flash memory of up to 256 kB. It also features a variety of peripherals including a 10/100 Ethernet MAC, two USB 2.0 ports, an LCD controller, an I2C interface, a UART, and a CAN bus. This SoC is also equipped with a range of power saving features such as dynamic voltage scaling, clock gating, and sleep modes.


The LFSCM3GA25EP1-5F900I is ideal for a wide range of embedded applications such as industrial automation, medical devices, consumer electronics, and automotive applications. It is also well-suited for applications that require low power consumption, high performance, and low cost. This chip is also RoHS compliant and is available in a range of packages, including LQFP, QFN, and BGA. It is also supported by a range of development tools, including an integrated development environment (IDE), a debugger, and an RTOS.



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