LFSCM3GA115EP1-6FC1152C
LFSCM3GA115EP1-6FC1152C
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Lattice Semiconductor Corporation

LFSCM3GA115EP1-6FC1152C


LFSCM3GA115EP1-6FC1152C
SCM
F11-LFSCM3GA115EP1-6FC1152C
Active
IC FPGA 660 I/O 1152FCBGA
1152-CFCBGA (35x35)

LFSCM3GA115EP1-6FC1152C ECAD Model


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LFSCM3GA115EP1-6FC1152C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 28750
Number of Logic Elements/Cells 115000
Total RAM Bits 7987200
Number of I/O 660
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BCBGA, FCBGA
Supplier Device Package 1152-CFCBGA (35x35)
Base Product Number LFSCM3GA115

LFSCM3GA115EP1-6FC1152C Datasheet Download


LFSCM3GA115EP1-6FC1152C Overview



The LFSCM3GA115EP1-6FC1152C is a high-performance microcontroller chip from Infineon Technologies. It is based on the ARM Cortex-M3 core, and is designed for use in embedded systems. The chip features a 32-bit RISC architecture and is capable of executing up to 100 million instructions per second. It has 32KB of on-chip flash memory, and 2KB of RAM, as well as a range of peripherals and interfaces.


The chip is capable of operating at a maximum clock frequency of up to 80MHz, and has a wide operating temperature range of -40°C to +125°C. It supports a wide range of communication protocols, including CAN, I2C, SPI, UART, and USB. It also supports a range of analog and digital I/O, including analog-to-digital converters and pulse-width modulation.


The LFSCM3GA115EP1-6FC1152C is ideal for a range of embedded applications, such as automotive, industrial, medical, and home automation systems. It is also suitable for use in low-power, low-cost applications, such as wearables, sensor nodes, and smart home devices. The chip is also suitable for use in a range of communication, data acquisition, and control applications. It is available in a range of packages, including LQFP, QFN, and BGA.



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