
Lattice Semiconductor Corporation
LFSCM3GA115EP1-6FC1152C
LFSCM3GA115EP1-6FC1152C ECAD Model
LFSCM3GA115EP1-6FC1152C Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | SCM | |
Package | Tray | |
Number of LABs/CLBs | 28750 | |
Number of Logic Elements/Cells | 115000 | |
Total RAM Bits | 7987200 | |
Number of I/O | 660 | |
Voltage - Supply | 0.95V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 1152-BCBGA, FCBGA | |
Supplier Device Package | 1152-CFCBGA (35x35) | |
Base Product Number | LFSCM3GA115 |
LFSCM3GA115EP1-6FC1152C Datasheet Download
LFSCM3GA115EP1-6FC1152C Overview
The LFSCM3GA115EP1-6FC1152C is a high-performance microcontroller chip from Infineon Technologies. It is based on the ARM Cortex-M3 core, and is designed for use in embedded systems. The chip features a 32-bit RISC architecture and is capable of executing up to 100 million instructions per second. It has 32KB of on-chip flash memory, and 2KB of RAM, as well as a range of peripherals and interfaces.
The chip is capable of operating at a maximum clock frequency of up to 80MHz, and has a wide operating temperature range of -40°C to +125°C. It supports a wide range of communication protocols, including CAN, I2C, SPI, UART, and USB. It also supports a range of analog and digital I/O, including analog-to-digital converters and pulse-width modulation.
The LFSCM3GA115EP1-6FC1152C is ideal for a range of embedded applications, such as automotive, industrial, medical, and home automation systems. It is also suitable for use in low-power, low-cost applications, such as wearables, sensor nodes, and smart home devices. The chip is also suitable for use in a range of communication, data acquisition, and control applications. It is available in a range of packages, including LQFP, QFN, and BGA.
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