LFSCM3GA115EP1-5FCN1152I
LFSCM3GA115EP1-5FCN1152I
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Lattice Semiconductor Corporation

LFSCM3GA115EP1-5FCN1152I


LFSCM3GA115EP1-5FCN1152I
SCM
F11-LFSCM3GA115EP1-5FCN1152I
Active
IC FPGA 660 I/O 1152FCBGA
1152-FCBGA (35x35)

LFSCM3GA115EP1-5FCN1152I ECAD Model


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LFSCM3GA115EP1-5FCN1152I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 28750
Number of Logic Elements/Cells 115000
Total RAM Bits 7987200
Number of I/O 660
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Base Product Number LFSCM3GA115

LFSCM3GA115EP1-5FCN1152I Datasheet Download


LFSCM3GA115EP1-5FCN1152I Overview



The LFSCM3GA115EP1-5FCN1152I is a low-power, high-performance System-on-Chip (SoC) designed for embedded applications. It is manufactured by Fujitsu Semiconductor and is based on the ARM Cortex-M3 processor core.


The chip features a 64-bit RISC processor with an embedded 32KB of instruction cache and 32KB of data cache. It also has a 512KB of SRAM memory, a 10/100 Ethernet controller, two USB 2.0 ports, a CAN bus controller, an SPI port, an I2C port, an UART port and a JTAG port. The chip is capable of running at up to 75MHz clock frequency and has an operating temperature range of -40°C to 85°C.


The LFSCM3GA115EP1-5FCN1152I is ideal for applications such as industrial automation, medical devices, consumer electronics, automotive and IoT. It has a wide range of features such as low power consumption, high performance, real-time support, flexible system integration, and integrated security.


The chip is also supported by a comprehensive development environment which includes a C/C++ compiler, a debugger, and a comprehensive set of libraries. This makes it easy for developers to create reliable and secure embedded applications.



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