
Lattice Semiconductor Corporation
LFSC3GA25E-6F900C
LFSC3GA25E-6F900C ECAD Model
LFSC3GA25E-6F900C Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | SC | |
Package | Tray | |
Number of LABs/CLBs | 6250 | |
Number of Logic Elements/Cells | 25000 | |
Total RAM Bits | 1966080 | |
Number of I/O | 378 | |
Voltage - Supply | 0.95V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 900-BBGA | |
Supplier Device Package | 900-FPBGA (31x31) | |
Base Product Number | LFSC3GA25 |
LFSC3GA25E-6F900C Datasheet Download
LFSC3GA25E-6F900C Overview
The LFSC3GA25E-6F900C is a microchip manufactured by Lattice Semiconductor Corporation and is part of the MachXO3 family of devices. It is a low-cost, low-power, non-volatile, field-programmable gate array (FPGA) that is ideal for applications that require a combination of low cost, low power, and high performance.
The LFSC3GA25E-6F900C is a high-density, low-power FPGA with a total of 25,600 logic elements. It features four banks of 6,400 logic elements each, providing a total of 25,600 logic elements. It also features a total of 1,400 I/O pins, with up to 200 user-configurable I/O pins. The device also includes up to 1,200 user-programmable flip-flops, up to 1,400 user-programmable registers, and up to 1,400 user-programmable logic blocks.
The chip is designed for applications that require low power consumption and a low cost. It is suitable for a wide range of applications, such as industrial automation, medical imaging, automotive, and consumer electronics. It is also well-suited for applications that require a high degree of flexibility and scalability.
The LFSC3GA25E-6F900C is also an ideal solution for system designers who require a low-cost, low-power FPGA with a high degree of flexibility and scalability. It is ideal for applications that require a combination of low cost, low power, and high performance. The device is also well-suited for applications that require a high degree of flexibility and scalability.
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