LFSC3GA25E-6F900C
LFSC3GA25E-6F900C
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Lattice Semiconductor Corporation

LFSC3GA25E-6F900C


LFSC3GA25E-6F900C
SC
F11-LFSC3GA25E-6F900C
Active
IC FPGA 378 I/O 900FBGA
900-FPBGA (31x31)

LFSC3GA25E-6F900C ECAD Model


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LFSC3GA25E-6F900C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SC
Package Tray
Number of LABs/CLBs 6250
Number of Logic Elements/Cells 25000
Total RAM Bits 1966080
Number of I/O 378
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FPBGA (31x31)
Base Product Number LFSC3GA25

LFSC3GA25E-6F900C Datasheet Download


LFSC3GA25E-6F900C Overview



The LFSC3GA25E-6F900C is a microchip manufactured by Lattice Semiconductor Corporation and is part of the MachXO3 family of devices. It is a low-cost, low-power, non-volatile, field-programmable gate array (FPGA) that is ideal for applications that require a combination of low cost, low power, and high performance.


The LFSC3GA25E-6F900C is a high-density, low-power FPGA with a total of 25,600 logic elements. It features four banks of 6,400 logic elements each, providing a total of 25,600 logic elements. It also features a total of 1,400 I/O pins, with up to 200 user-configurable I/O pins. The device also includes up to 1,200 user-programmable flip-flops, up to 1,400 user-programmable registers, and up to 1,400 user-programmable logic blocks.


The chip is designed for applications that require low power consumption and a low cost. It is suitable for a wide range of applications, such as industrial automation, medical imaging, automotive, and consumer electronics. It is also well-suited for applications that require a high degree of flexibility and scalability.


The LFSC3GA25E-6F900C is also an ideal solution for system designers who require a low-cost, low-power FPGA with a high degree of flexibility and scalability. It is ideal for applications that require a combination of low cost, low power, and high performance. The device is also well-suited for applications that require a high degree of flexibility and scalability.



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