LFECP33E-4F672C
LFECP33E-4F672C
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Lattice Semiconductor Corporation

LFECP33E-4F672C


LFECP33E-4F672C
ECP
F11-LFECP33E-4F672C
Active
IC FPGA 496 I/O 672FPBGA
672-FPBGA (27x27)

LFECP33E-4F672C ECAD Model


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LFECP33E-4F672C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP
Package Tray
Number of Logic Elements/Cells 32800
Total RAM Bits 434176
Number of I/O 496
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 672-BBGA
Supplier Device Package 672-FPBGA (27x27)
Base Product Number LFECP33

LFECP33E-4F672C Overview



The LFECP33E-4F672C is a highly integrated and low-power chip model designed for use in a variety of embedded applications. It is based on the ARM Cortex-M3 processor core, with an integrated floating point unit (FPU) and memory protection unit (MPU). The chip features a wide range of peripherals, including communication interfaces, timers, system control, and analog-to-digital converters. It is capable of operating at up to 120 MHz and can be used in a variety of applications, including industrial control, medical devices, automotive systems, and consumer electronics.


The chip has a 32-bit RISC architecture, with a 16-bit memory bus and a 32-bit instruction set. It features a 32-bit external memory interface, with support for up to 16Mbytes of Flash and 4Mbytes of SRAM. It also has a variety of communication interfaces, including I2C, SPI, UART, and CAN. Additionally, the chip has several timers, including a 16-bit timer, a 32-bit timer, and a PWM timer. It also has a system control unit, which provides system control and reset functions.


The chip is designed to operate at a low power consumption, with a maximum current of 8mA. It is also designed to operate at a wide temperature range, from -40°C to +85°C. It is also designed to be highly reliable, with a mean time between failures (MTBF) of over 1 million hours.


The LFECP33E-4F672C chip is suitable for use in a variety of embedded applications, such as industrial control, medical devices, automotive systems, and consumer electronics. It is a cost-effective solution for these applications, offering a high level of integration and low power consumption.



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