
Lattice Semiconductor Corporation
LFE3-70E-6FN672C
LFE3-70E-6FN672C ECAD Model
LFE3-70E-6FN672C Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ECP3 | |
Package | Tray | |
Number of LABs/CLBs | 8375 | |
Number of Logic Elements/Cells | 67000 | |
Total RAM Bits | 4526080 | |
Number of I/O | 380 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 672-BBGA | |
Supplier Device Package | 672-FPBGA (27x27) | |
Base Product Number | LFE3-70 |
LFE3-70E-6FN672C Datasheet Download
LFE3-70E-6FN672C Overview
The LFE3-70E-6FN672C is a low-power, low-cost field-programmable gate array (FPGA) chip developed by Intel Corporation. It is based on the 28nm process technology and is designed for a wide range of applications, such as embedded systems, industrial automation, and consumer electronics.
The LFE3-70E-6FN672C has a total of 672 logic elements, each of which is capable of performing up to 6 million logic operations per second. It also features an integrated transceiver with a maximum data rate of 28 Gbps, and a total of 836 user I/O pins. It is equipped with a dedicated low-power supply, and can operate at a maximum temperature of 85°C.
The LFE3-70E-6FN672C is designed with an advanced FPGA fabric that provides high performance, low latency, and low power consumption. It also features a comprehensive set of design tools and IP cores, enabling developers to quickly and easily create custom solutions.
The LFE3-70E-6FN672C is ideal for a wide range of applications, such as industrial automation, embedded systems, and consumer electronics. Its low-power consumption and advanced features make it an ideal choice for applications that require high performance and low power consumption. In addition, its high-speed transceiver and wide range of I/O pins make it suitable for high-speed data transfer applications.
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Pricing (USD)
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