LFE3-70E-6FN672C
LFE3-70E-6FN672C
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Lattice Semiconductor Corporation

LFE3-70E-6FN672C


LFE3-70E-6FN672C
F11-LFE3-70E-6FN672C
Active
IC FPGA 380 I/O 672FPBGA
672-FPBGA (27x27)

LFE3-70E-6FN672C ECAD Model


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LFE3-70E-6FN672C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP3
Package Tray
Number of LABs/CLBs 8375
Number of Logic Elements/Cells 67000
Total RAM Bits 4526080
Number of I/O 380
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 672-BBGA
Supplier Device Package 672-FPBGA (27x27)
Base Product Number LFE3-70

LFE3-70E-6FN672C Datasheet Download


LFE3-70E-6FN672C Overview



The LFE3-70E-6FN672C is a low-power, low-cost field-programmable gate array (FPGA) chip developed by Intel Corporation. It is based on the 28nm process technology and is designed for a wide range of applications, such as embedded systems, industrial automation, and consumer electronics.


The LFE3-70E-6FN672C has a total of 672 logic elements, each of which is capable of performing up to 6 million logic operations per second. It also features an integrated transceiver with a maximum data rate of 28 Gbps, and a total of 836 user I/O pins. It is equipped with a dedicated low-power supply, and can operate at a maximum temperature of 85°C.


The LFE3-70E-6FN672C is designed with an advanced FPGA fabric that provides high performance, low latency, and low power consumption. It also features a comprehensive set of design tools and IP cores, enabling developers to quickly and easily create custom solutions.


The LFE3-70E-6FN672C is ideal for a wide range of applications, such as industrial automation, embedded systems, and consumer electronics. Its low-power consumption and advanced features make it an ideal choice for applications that require high performance and low power consumption. In addition, its high-speed transceiver and wide range of I/O pins make it suitable for high-speed data transfer applications.



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