LFECP33E-3FN672I
LFECP33E-3FN672I
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rohs

Lattice Semiconductor Corporation

LFECP33E-3FN672I


LFECP33E-3FN672I
ECP
F11-LFECP33E-3FN672I
Active
IC FPGA 496 I/O 672FPBGA
672-FPBGA (27x27)

LFECP33E-3FN672I ECAD Model


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LFECP33E-3FN672I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP
Package Tray
Number of Logic Elements/Cells 32800
Total RAM Bits 434176
Number of I/O 496
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 672-BBGA
Supplier Device Package 672-FPBGA (27x27)
Base Product Number LFECP33

LFECP33E-3FN672I Datasheet Download


LFECP33E-3FN672I Overview



The LFECP33E-3FN672I is a low-power, highly integrated, low-cost Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It is based on the LatticeECP3 FPGA architecture, which offers high performance, low power consumption and scalability. The device features 3.3V I/O, 672 user I/O pins, and up to 33K logic elements. It is capable of delivering up to 800MHz performance in a wide range of applications.


The device provides a range of features, such as high-speed SERDES, DDR2/DDR3/QDRII/QDRII+/RLDRAM memory interfaces, up to 8 PLLs, up to 8 DSP blocks and up to 4 Multi Gigabit Transceivers (MGTs). It also includes a range of embedded peripherals, such as SPI, I2C, UART, CAN, and GPIO.


The LFECP33E-3FN672I is suitable for a wide range of applications, including industrial automation, medical devices, automotive, communications, consumer, and military/aerospace. It is also suitable for applications such as digital signal processing, image processing, high-speed communications, and high-speed networking.


The device is available in a range of packages, including a 484-pin BGA, a 384-pin BGA, and a 256-pin BGA. It is also RoHS compliant and meets the requirements of the European Union's Restriction of Hazardous Substances (RoHS) directive.



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