LFEC33E-4FN672I
LFEC33E-4FN672I
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Lattice Semiconductor Corporation

LFEC33E-4FN672I


LFEC33E-4FN672I
EC
F11-LFEC33E-4FN672I
Active
IC FPGA 496 I/O 672FPBGA
672-FPBGA (27x27)

LFEC33E-4FN672I ECAD Model


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LFEC33E-4FN672I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series EC
Package Tray
Number of Logic Elements/Cells 32800
Total RAM Bits 434176
Number of I/O 496
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 672-BBGA
Supplier Device Package 672-FPBGA (27x27)
Base Product Number LFEC33

LFEC33E-4FN672I Datasheet Download


LFEC33E-4FN672I Overview



The LFEC33E-4FN672I is a low-power, high-performance field-programmable gate array (FPGA) chip manufactured by Lattice Semiconductor Corporation. This chip is designed for use in a wide range of applications such as embedded systems, industrial automation, automotive, and consumer electronics.


The LFEC33E-4FN672I is a 4-layer FPGA chip with a total of 672 logic elements, including 4Kbits of embedded block RAM, and two dedicated I/Os. It has a maximum operating frequency of 125MHz and a power dissipation of 1.2W. The chip also supports up to 32-bit wide user-defined instructions and provides a wide range of features such as programmable I/O, clock management, power optimization, and enhanced security.


The LFEC33E-4FN672I has a low-power design that enables it to operate at a power efficiency of up to 90%. It is also equipped with built-in system-level features such as programmable I/O, clock management, power optimization, and enhanced security. Additionally, the chip has an integrated USB 2.0 PHY and supports up to 32-bit wide user-defined instructions.


In conclusion, the LFEC33E-4FN672I is a high-performance, low-power FPGA chip that is suitable for a wide range of applications. It has a maximum operating frequency of 125MHz, a power dissipation of 1.2W, and a power efficiency of up to 90%. It also has a range of features such as programmable I/O, clock management, power optimization, and enhanced security.



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