LFE3-70EA-7LFN672I

The LFE3-70EA-7LFN672I is a Field Programmable Gate Array (FPGA) chip manufactured by Intel. It is a low-cost, low-power device designed for embedded applications, such as automotive, industrial, and consumer electronics. The chip is based on Intel’s 28nm Enhanced Super Low Power (ESLP) process technology, and is optimized for the low power and high performance requirements of embedded applications.

The LFE3-70EA-7LFN672I is a high-density device with a total of 7 million logic elements and over 7 million flip-flops. It also has a total of 672 I/O pins, including 72 LVDS pairs, and an integrated transceiver for high-speed serial data transmission. The device offers a wide range of features, such as dynamic power management, adaptive clocking, and advanced security features.

The LFE3-70EA-7LFN672I is ideal for applications that require low power, high performance, and high I/O density. It can be used in a variety of applications, including automotive infotainment systems, industrial automation, medical devices, and consumer electronics. The device also supports a wide range of programming languages, including Verilog, VHDL, SystemVerilog, and SystemC.