LFE3-70EA-6LFN672I

The LFE3-70EA-6LFN672I is a low-power, high-performance FPGA chip from Intel. It is based on the 28nm Enhanced Super Low Power (ESLP) process technology and is designed for a wide range of applications. It features 6.7 million logic elements, up to 4,096 Kbits of embedded memory, and up to 4,096 Kbits of distributed RAM. It also supports up to 672 I/O pins, including 144 differential I/O pairs and 8 dedicated clock pins. It is capable of operating at up to 300 MHz and provides up to 70 Gbps of bandwidth.

The LFE3-70EA-6LFN672I is designed to provide low-power operation and high performance in a wide variety of applications. It is suitable for use in a range of embedded applications such as industrial automation, automotive, consumer electronics, medical, and aerospace & defense. It is also ideal for use in communications, networking, and storage applications. The chip is designed to be scalable, allowing it to be used in a variety of applications.

The chip also supports a range of features to enhance performance and reduce power consumption. These include power-down modes, dynamic voltage and frequency scaling, and adaptive voltage scaling. It also supports advanced features such as differential clock support, on-chip termination, and clock domain crossing.

Overall, the LFE3-70EA-6LFN672I is a low-power, high-performance FPGA chip from Intel. It is designed for a wide range of applications, including embedded, communications, networking, and storage applications. It features 6.7 million logic elements, up to 4,096 Kbits of embedded memory, and up to 4,096 Kbits of distributed RAM, and up to 672 I/O pins. It also supports a range of advanced features to enhance performance and reduce power consumption.