LFE3-70E-7FN1156I
LFE3-70E-7FN1156I
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Lattice Semiconductor Corporation

LFE3-70E-7FN1156I


LFE3-70E-7FN1156I
F11-LFE3-70E-7FN1156I
Active
IC FPGA 490 I/O 1156FBGA
1156-FPBGA (35x35)

LFE3-70E-7FN1156I ECAD Model


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LFE3-70E-7FN1156I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP3
Package Tray
Number of LABs/CLBs 8375
Number of Logic Elements/Cells 67000
Total RAM Bits 4526080
Number of I/O 490
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1156-BBGA
Supplier Device Package 1156-FPBGA (35x35)
Base Product Number LFE3-70

LFE3-70E-7FN1156I Datasheet Download


LFE3-70E-7FN1156I Overview



The LFE3-70E-7FN1156I is an FPGA chip model from Intel. It is a low-cost, low-power, and high-performance FPGA, designed for the highest levels of flexibility and scalability. It has a maximum system clock frequency of up to 700 MHz, and a total of 11,568 logic elements. It is available in a variety of packages, including a 7mm x 7mm BGA package.


The LFE3-70E-7FN1156I has a range of features that make it suitable for a variety of applications. It has a high-speed transceiver, which supports up to 25 Gbps transceiver data rate. It also supports up to 11,568 logic elements and up to 576 user I/Os. It also has a large amount of internal memory, with up to 4GB of on-chip RAM and up to 1GB of on-chip Flash memory.


The LFE3-70E-7FN1156I is suitable for a range of applications, including industrial automation, medical imaging, and communications systems. It is particularly well-suited for applications that require high levels of integration, scalability, and flexibility. It is also suitable for use in applications that require high-speed data transfer and processing, such as 5G networks. Additionally, it is compatible with a range of development tools, making it easy to use and program.


Overall, the LFE3-70E-7FN1156I is a powerful and flexible FPGA chip model, with a range of features that make it suitable for a variety of applications. It is low-cost, low-power, and high-performance, making it an ideal choice for applications that require high levels of integration, scalability, and flexibility.



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