
Lattice Semiconductor Corporation
LFE3-70E-7FN1156I
LFE3-70E-7FN1156I ECAD Model
LFE3-70E-7FN1156I Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ECP3 | |
Package | Tray | |
Number of LABs/CLBs | 8375 | |
Number of Logic Elements/Cells | 67000 | |
Total RAM Bits | 4526080 | |
Number of I/O | 490 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 1156-BBGA | |
Supplier Device Package | 1156-FPBGA (35x35) | |
Base Product Number | LFE3-70 |
LFE3-70E-7FN1156I Datasheet Download
LFE3-70E-7FN1156I Overview
The LFE3-70E-7FN1156I is an FPGA chip model from Intel. It is a low-cost, low-power, and high-performance FPGA, designed for the highest levels of flexibility and scalability. It has a maximum system clock frequency of up to 700 MHz, and a total of 11,568 logic elements. It is available in a variety of packages, including a 7mm x 7mm BGA package.
The LFE3-70E-7FN1156I has a range of features that make it suitable for a variety of applications. It has a high-speed transceiver, which supports up to 25 Gbps transceiver data rate. It also supports up to 11,568 logic elements and up to 576 user I/Os. It also has a large amount of internal memory, with up to 4GB of on-chip RAM and up to 1GB of on-chip Flash memory.
The LFE3-70E-7FN1156I is suitable for a range of applications, including industrial automation, medical imaging, and communications systems. It is particularly well-suited for applications that require high levels of integration, scalability, and flexibility. It is also suitable for use in applications that require high-speed data transfer and processing, such as 5G networks. Additionally, it is compatible with a range of development tools, making it easy to use and program.
Overall, the LFE3-70E-7FN1156I is a powerful and flexible FPGA chip model, with a range of features that make it suitable for a variety of applications. It is low-cost, low-power, and high-performance, making it an ideal choice for applications that require high levels of integration, scalability, and flexibility.
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