Lattice Semiconductor Corporation
LFE2M70SE-6FN900C
LFE2M70SE-6FN900C ECAD Model
LFE2M70SE-6FN900C Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | Lattice Semiconductor Corporation | |
| Series | ECP2M | |
| Package | Tray | |
| Number of LABs/CLBs | 8375 | |
| Number of Logic Elements/Cells | 67000 | |
| Total RAM Bits | 4642816 | |
| Number of I/O | 416 | |
| Voltage - Supply | 1.14V ~ 1.26V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 900-BBGA | |
| Supplier Device Package | 900-FPBGA (31x31) | |
| Base Product Number | LFE2M70 |
LFE2M70SE-6FN900C Datasheet Download
LFE2M70SE-6FN900C Overview
The LFE2M70SE-6FN900C is a low-power, high-performance FPGA chip manufactured by Lattice Semiconductor. It is designed for use in a wide range of telecommunications, networking and consumer applications.
The chip has a 6-layer metal process and is available in a 900-pin BGA package. It is capable of operating at speeds up to 400MHz, making it suitable for high-speed applications. It also offers a wide range of features, such as low-power consumption, high-density logic, and low-latency routing.
The chip has an array of configurable logic blocks, flip-flops, and RAM blocks, and supports up to 1.8 million logic cells. It also has a wide range of I/O options, including LVDS, PCI Express, USB, and Ethernet.
The LFE2M70SE-6FN900C is ideal for a variety of applications, including industrial automation, medical imaging, automotive, and consumer electronics. It is a cost-effective solution for high-speed, low-power applications, and is suitable for designs requiring high performance and flexibility.
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3,313 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $244.8515 | $244.8515 |
| 10+ | $242.2187 | $2,422.1870 |
| 100+ | $229.0546 | $22,905.4644 |
| 1000+ | $215.8906 | $107,945.2920 |
| 10000+ | $197.4609 | $197,460.9000 |
| The price is for reference only, please refer to the actual quotation! | ||