LFE2M70SE-6F900C
LFE2M70SE-6F900C
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Lattice Semiconductor Corporation

LFE2M70SE-6F900C


LFE2M70SE-6F900C
F11-LFE2M70SE-6F900C
Active
IC FPGA 416 I/O 900FBGA
900-FPBGA (31x31)

LFE2M70SE-6F900C ECAD Model


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LFE2M70SE-6F900C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP2M
Package Tray
Number of LABs/CLBs 8375
Number of Logic Elements/Cells 67000
Total RAM Bits 4642816
Number of I/O 416
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FPBGA (31x31)
Base Product Number LFE2M70

LFE2M70SE-6F900C Datasheet Download


LFE2M70SE-6F900C Overview



The LFE2M70SE-6F900C is a low-power, low-cost, high-performance FPGA chip from Lattice Semiconductor. It is designed for a wide range of applications, including industrial, automotive, consumer, and communications.


The chip features a high-speed, low-power architecture, with a maximum operating frequency of 900 MHz. It offers a total of 4.7 million logic elements, including 1,984 18-Kb RAM blocks, and 4,096 DSP slices. The chip also has a total of 1,536 I/O pins, and supports up to eight high-speed SERDES transceivers.


In terms of power consumption, the LFE2M70SE-6F900C is designed to minimize power consumption while still offering high performance. It has a total power consumption of 1.2 watts, and can operate at temperatures ranging from -40 to +85 degrees Celsius.


The chip also offers a variety of features, such as advanced power management, clock management, and design security. It is also compatible with a variety of development tools, including Lattice Diamond, Lattice Radiant, and Lattice Libero.


Overall, the LFE2M70SE-6F900C is a low-power, low-cost, high-performance FPGA chip from Lattice Semiconductor. It is designed for a wide range of applications, and offers a variety of features, such as advanced power management, clock management, and design security.



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