LFE2M70E-6FN1152I

The LFE2M70E-6FN1152I is a low-power, low-cost, and low-footprint FPGA chip from Lattice Semiconductor. It is built using a 28nm process technology, and is designed for a wide range of applications, from consumer to industrial.

The chip features a 6-layer metal stack, and provides up to 1,152 LUTs and 6,144 flip-flops. It also has up to 1,536 Kbits of block RAM, and up to 32 user I/Os. The chip supports a wide range of I/O standards, including LVDS, LVCMOS, and HSTL. It also supports a wide range of clock frequencies, from 25MHz to 200MHz.

The chip is designed to be used in a variety of applications, such as automotive, industrial, consumer, and medical. It is suitable for use in applications such as motor control, power management, and communication systems. It can also be used in applications such as video processing, image processing, and audio processing.

The chip has a low power consumption of 1.5W, and a wide temperature range of -40°C to +85°C. It is also RoHS compliant, and is designed for use in a wide range of industrial and consumer applications.

Overall, the LFE2M70E-6FN1152I is a low-power, low-cost, and low-footprint FPGA chip from Lattice Semiconductor, designed for a wide range of applications. It is suitable for use in applications such as motor control, power management, communication systems, video processing, image processing, and audio processing. It also has a low power consumption and a wide temperature range.