LFE2M70E-6F900I

The LFE2M70E-6F900I is a low-power, low-footprint FPGA chip designed for a wide range of applications. It is manufactured by Lattice Semiconductor and is part of the MachXO2 family.

The chip has a maximum power consumption of 1.2 W and a maximum operating temperature of 85 degrees Celsius. It has a total of 9,000 logic elements and a maximum clock frequency of 300 MHz. It also has 128 Kbits of SRAM and 8 Kbits of EEPROM. It is built on a 0.6 mm pitch, 80-pin LQFP package and features a wide range of I/O options, including LVTTL, LVCMOS, and PCI Express.

The LFE2M70E-6F900I is ideal for applications such as industrial control systems, medical devices, consumer electronics, and automotive systems. It is also well-suited for use in a wide range of applications that require low-power and low-footprint solutions.

The chip's features make it suitable for use in a variety of applications. It can be used to create highly integrated systems that require low-power and low-footprint solutions. It is also suitable for use in applications that require high speed and reliability. The chip's wide range of I/O options also makes it well-suited for use in applications that require flexibility and scalability.