LFE2M50SE-6FN900I
LFE2M50SE-6FN900I
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Lattice Semiconductor Corporation

LFE2M50SE-6FN900I


LFE2M50SE-6FN900I
F11-LFE2M50SE-6FN900I
Active
IC FPGA 410 I/O 900FBGA
900-FPBGA (31x31)

LFE2M50SE-6FN900I ECAD Model


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LFE2M50SE-6FN900I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP2M
Package Tray
Number of LABs/CLBs 6000
Number of Logic Elements/Cells 48000
Total RAM Bits 4246528
Number of I/O 410
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FPBGA (31x31)
Base Product Number LFE2M50

LFE2M50SE-6FN900I Datasheet Download


LFE2M50SE-6FN900I Overview



The LFE2M50SE-6FN900I is a high performance, low power, field programmable gate array (FPGA) chip manufactured by Lattice Semiconductor. The chip is designed to provide a low cost, high performance solution for a wide range of applications. It features a 6-layer metal stack, with up to 900 I/O pins, and a total of 1.3 million logic elements. The chip has an operating voltage range of 1.2V to 3.3V, and a maximum clock frequency of 350MHz. It also features a wide range of memory, DSP, and I/O blocks, as well as on-chip power management circuitry.


The chip is suitable for a wide range of applications, including embedded systems, communications, industrial automation, automotive, and consumer electronics. It can be used for high speed data processing, data acquisition, signal processing, and control applications. The chip also supports a range of communication protocols, including Ethernet, USB, and CAN.


The chip is also designed for reliability, with built-in ESD protection, power-on reset, and a wide range of safety features. It is also designed to be highly configurable, with a wide range of configurable I/O, memory, and DSP blocks. The chip is also designed to be easily integrated into existing systems, with a wide range of development tools and libraries available.


Overall, the LFE2M50SE-6FN900I is a high performance, low power, field programmable gate array (FPGA) chip that is suitable for a wide range of applications, including embedded systems, communications, industrial automation, automotive, and consumer electronics. It features a 6-layer metal stack, up to 900 I/O pins, and a total of 1.3 million logic elements, and is designed for reliability, configurability, and ease of integration.



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Unit Price: $219.6412
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $204.2663 $204.2663
10+ $202.0699 $2,020.6990
100+ $191.0878 $19,108.7844
1000+ $180.1058 $90,052.8920
10000+ $164.7309 $164,730.9000
The price is for reference only, please refer to the actual quotation!

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