LFE2M50SE-6FN672C

The LFE2M50SE-6FN672C is an FPGA (Field Programmable Gate Array) chip model from Intel. It is based on the 28nm Enhanced Super Low Power (ESLP) process and is designed for low-power applications. It has a maximum power dissipation of 1.5W and a minimum power dissipation of 0.7W. It supports up to 6,144 logic elements and has a maximum operating frequency of 250MHz. The chip also features 8,192 Kbits of embedded block RAM, with a maximum clock frequency of 250MHz. It is designed to support a wide range of applications, including embedded systems, industrial automation, medical imaging, and automotive control systems.

The LFE2M50SE-6FN672C has a total of 672 pins, including I/O, power, and configuration pins. It supports a wide range of I/O standards, including LVDS, LVCMOS, SSTL, and HSTL. It also supports a variety of configuration protocols, including JTAG, AS, PS, and SPI. The chip has a maximum operating temperature of 85°C and a maximum junction temperature of 125°C. It also has a wide range of packages, including BGA, LFBGA, and TFBGA.

The LFE2M50SE-6FN672C is an ideal choice for low-power applications that require high performance and reliability. Its low power consumption and wide range of features make it suitable for a variety of applications, from embedded systems to industrial automation and medical imaging. Its flexibility and scalability make it an ideal solution for a wide range of applications.