LFE2M50SE-5F900I
LFE2M50SE-5F900I
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Lattice Semiconductor Corporation

LFE2M50SE-5F900I


LFE2M50SE-5F900I
F11-LFE2M50SE-5F900I
Active
IC FPGA 410 I/O 900FBGA
900-FPBGA (31x31)

LFE2M50SE-5F900I ECAD Model


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LFE2M50SE-5F900I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP2M
Package Tray
Number of LABs/CLBs 6000
Number of Logic Elements/Cells 48000
Total RAM Bits 4246528
Number of I/O 410
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FPBGA (31x31)
Base Product Number LFE2M50

LFE2M50SE-5F900I Datasheet Download


LFE2M50SE-5F900I Overview



The LFE2M50SE-5F900I is a low-power, low-cost FPGA chip from Lattice Semiconductor. It is designed for a variety of applications, including embedded systems, industrial automation, and medical imaging.


The chip has a capacity of 5 million system gates, and a maximum power consumption of 2.5 W. It is designed to be used in a wide range of applications, including embedded systems, industrial automation, and medical imaging. It has an array of features, including high-speed transceivers, low-power SRAM, and an array of I/O options. The chip also supports a wide range of industry-standard IP cores, as well as an array of high-speed interfaces.


The chip has a range of features to ensure reliable operation in a variety of applications. It has a low-power, low-cost design, and is optimized for high-performance, low-power operation. It has an array of features, including high-speed transceivers, low-power SRAM, and an array of I/O options. It also supports a wide range of industry-standard IP cores, as well as an array of high-speed interfaces.


The LFE2M50SE-5F900I is a versatile and reliable chip for a variety of embedded systems and industrial automation applications. It is designed for low-power, low-cost operation, and has an array of features to ensure reliable operation in a variety of applications. It is a great choice for embedded systems, industrial automation, and medical imaging applications.



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