
Lattice Semiconductor Corporation
LFE2M50E-6F900C
LFE2M50E-6F900C ECAD Model
LFE2M50E-6F900C Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ECP2M | |
Package | Tray | |
Number of LABs/CLBs | 6000 | |
Number of Logic Elements/Cells | 48000 | |
Total RAM Bits | 4246528 | |
Number of I/O | 410 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 900-BBGA | |
Supplier Device Package | 900-FPBGA (31x31) | |
Base Product Number | LFE2M50 |
LFE2M50E-6F900C Datasheet Download
LFE2M50E-6F900C Overview
The LFE2M50E-6F900C is a low-power, low-voltage, non-volatile FPGA (Field Programmable Gate Array) chip manufactured by Lattice Semiconductor. It is based on the LatticeECP2M architecture and is designed for applications requiring high performance and low power consumption.
The chip features a wide range of features, including up to 50K logic elements, up to 1.4 million system gates, up to 1.25 million flip-flops, and up to 1.6 million 4-input look-up tables. It also has up to 16 DSP blocks and up to 8 PLLs. The chip supports multiple I/O standards, including LVTTL, LVCMOS, LVPECL, HSTL, and SSTL. It also comes with an on-chip phase-locked loop (PLL) and a high-speed serializer/deserializer (SERDES) interface.
The LFE2M50E-6F900C is ideal for applications such as consumer electronics, automotive, industrial, and communications. It can be used to develop a wide range of designs, including high-speed networking, video processing, and embedded systems. It is also suitable for applications that require low power consumption, such as battery-powered devices and wearable electronics.
Overall, the LFE2M50E-6F900C is a powerful and energy-efficient chip that is suitable for a variety of applications. It is highly customizable and can be used to develop a wide range of designs. Its low-power and high-performance features make it an ideal choice for a variety of applications.
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