
Lattice Semiconductor Corporation
LFE2M100SE-6F900C
LFE2M100SE-6F900C ECAD Model
LFE2M100SE-6F900C Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ECP2M | |
Package | Tray | |
Number of LABs/CLBs | 11875 | |
Number of Logic Elements/Cells | 95000 | |
Total RAM Bits | 5435392 | |
Number of I/O | 416 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 900-BBGA | |
Supplier Device Package | 900-FPBGA (31x31) | |
Base Product Number | LFE2M100 |
LFE2M100SE-6F900C Datasheet Download
LFE2M100SE-6F900C Overview
The LFE2M100SE-6F900C is a low-power, low-cost FPGA (Field Programmable Gate Array) chip. It is designed for use in a variety of applications, including signal processing, networking, and embedded systems. It is based on the Lattice MachXO2 architecture and is manufactured using a 90 nm CMOS process.
The chip has a total of 6,900 logic elements, with a maximum clock frequency of 150 MHz. It also has 8 Kbits of SRAM, as well as 4 DSP blocks, for signal processing. It has a total of 4 clock management blocks, and 6 dedicated I/O pins. It also has a total of 4 PLLs for clock synthesis and phase-shifting.
The chip is designed for low power consumption, with a typical power consumption of 0.7 W at a temperature of 85°C. It has a wide operating temperature range of -40°C to +85°C. It is also designed for high reliability, with an MTBF of 1.3 million hours.
The chip is designed to be used in a variety of applications, such as networking, embedded systems, and signal processing. It is suitable for use in a wide range of applications, including industrial, medical, automotive, and consumer applications. It is also suitable for use in high-performance computing applications.
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