LFE2M100SE-6F900C
LFE2M100SE-6F900C
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Lattice Semiconductor Corporation

LFE2M100SE-6F900C


LFE2M100SE-6F900C
F11-LFE2M100SE-6F900C
Active
IC FPGA 416 I/O 900FBGA
900-FPBGA (31x31)

LFE2M100SE-6F900C ECAD Model


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LFE2M100SE-6F900C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP2M
Package Tray
Number of LABs/CLBs 11875
Number of Logic Elements/Cells 95000
Total RAM Bits 5435392
Number of I/O 416
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FPBGA (31x31)
Base Product Number LFE2M100

LFE2M100SE-6F900C Datasheet Download


LFE2M100SE-6F900C Overview



The LFE2M100SE-6F900C is a low-power, low-cost FPGA (Field Programmable Gate Array) chip. It is designed for use in a variety of applications, including signal processing, networking, and embedded systems. It is based on the Lattice MachXO2 architecture and is manufactured using a 90 nm CMOS process.


The chip has a total of 6,900 logic elements, with a maximum clock frequency of 150 MHz. It also has 8 Kbits of SRAM, as well as 4 DSP blocks, for signal processing. It has a total of 4 clock management blocks, and 6 dedicated I/O pins. It also has a total of 4 PLLs for clock synthesis and phase-shifting.


The chip is designed for low power consumption, with a typical power consumption of 0.7 W at a temperature of 85°C. It has a wide operating temperature range of -40°C to +85°C. It is also designed for high reliability, with an MTBF of 1.3 million hours.


The chip is designed to be used in a variety of applications, such as networking, embedded systems, and signal processing. It is suitable for use in a wide range of applications, including industrial, medical, automotive, and consumer applications. It is also suitable for use in high-performance computing applications.



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