
Lattice Semiconductor Corporation
LFE2M100E-5F900C
LFE2M100E-5F900C ECAD Model
LFE2M100E-5F900C Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ECP2M | |
Package | Tray | |
Number of LABs/CLBs | 11875 | |
Number of Logic Elements/Cells | 95000 | |
Total RAM Bits | 5435392 | |
Number of I/O | 416 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 900-BBGA | |
Supplier Device Package | 900-FPBGA (31x31) | |
Base Product Number | LFE2M100 |
LFE2M100E-5F900C Datasheet Download
LFE2M100E-5F900C Overview
The LFE2M100E-5F900C is a Field Programmable Gate Array (FPGA) chip designed and manufactured by Lattice Semiconductor. It is a low-power, low-cost, and low-density FPGA with a range of features that make it suitable for a variety of applications.
The LFE2M100E-5F900C has a 2 million system gate capacity and is based on the LatticeECP2M-5F900C device family. It has a maximum operating frequency of 300 MHz and a maximum I/O pin count of 1,536. It also features two low-power modes, Power-Down and Sleep, which can reduce power consumption by up to 70%. It has an on-chip oscillator and a range of I/O options, including LVDS, LVCMOS, and SERDES.
The LFE2M100E-5F900C is suitable for a range of applications, including industrial automation, medical devices, consumer electronics, and automotive. It is also suitable for use in embedded systems, automotive infotainment systems, and video surveillance. It is also suitable for use in applications that require low-cost and low-power operation, such as battery-powered devices.
In summary, the LFE2M100E-5F900C is a low-cost and low-power FPGA chip with a range of features that make it suitable for a variety of applications, including industrial automation, medical devices, consumer electronics, and automotive.
You May Also Be Interested In
1,801 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |