LFE2-70SE-6FN672C

The LFE2-70SE-6FN672C is an FPGA chip model developed by Lattice Semiconductor. It is a low-power, low-cost FPGA with a wide range of features and applications. The chip is based on the LatticeECP2M architecture, and is designed to be used in a variety of applications.

The LFE2-70SE-6FN672C features a total of 6,672 logic elements, including 6,144 logic cells, 16 DSP blocks, and 512 RAM blocks. It also includes a total of 8,192 I/Os, of which 1,536 are differential I/Os, and 6,656 are single-ended I/Os. The chip also features a total of 6,144 flip-flops, and a total of 1,792 user-configurable I/Os.

The chip is capable of operating at a maximum speed of 300 MHz, and is available in a range of package sizes, including a 6x6mm, 0.5mm pitch, BGA package. The chip is also rated to operate over a temperature range of -40 to +85 degrees Celsius.

The LFE2-70SE-6FN672C is suitable for a wide range of applications, including communications, data processing, industrial automation, automotive, and consumer electronics. It is also suitable for use in low-power, low-cost applications, such as wearable devices and IoT applications.